Invention Grant
- Patent Title: Wafer and method for processing a wafer
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Application No.: US16120485Application Date: 2018-09-04
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Publication No.: US10600701B2Publication Date: 2020-03-24
- Inventor: Gunther Mackh , Gerhard Leschik , Maria Heidenblut
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner MBB
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/683
Abstract:
A wafer in accordance with various embodiments may include: at least one metallization structure including at least one opening; and at least one separation line region along which the wafer is to be diced, wherein the at least one separation line region intersects the at least one opening.
Public/Granted literature
- US20180374766A1 WAFER AND METHOD FOR PROCESSING A WAFER Public/Granted day:2018-12-27
Information query
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