Invention Grant
- Patent Title: Method of monitoring processing system for processing substrate
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Application No.: US15427279Application Date: 2017-02-08
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Publication No.: US10606253B2Publication Date: 2020-03-31
- Inventor: Lian-Hua Shih , Chia-Chi Chang , Li-Ting Lin , Ching-Hsing Hsieh , Feng-Chi Chung , Meng-Chih Chang , Ming-Tung Wang , Chiu-Ping Chang , Yung-Yu Yang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Main IPC: G05B23/02
- IPC: G05B23/02

Abstract:
A method of monitoring a processing system for processing a substrate is provided. The method includes the following steps: acquiring data from the processing system for a plurality of parameters, the data including a plurality of data values; grouping the parameters into a plurality of sub-groups, each of the sub-groups including a plurality of correlated parameters; constructing a principle components analysis (PCA) model from the data values for the correlated parameters in a first one of the sub-groups, including normalizing the data values in the first one of the sub-groups with a first weighting factor and a second weighting factor, wherein the first weighting factor is different from the second weighting factor; and determining a statistical quantity using the PCA model.
Public/Granted literature
- US20180224817A1 METHOD OF MONITORING PROCESSING SYSTEM FOR PROCESSING SUBSTRATE Public/Granted day:2018-08-09
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