Invention Grant
- Patent Title: Method for forming a semiconductor device structure comprising a gate fill metal
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Application No.: US15707786Application Date: 2017-09-18
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Publication No.: US10607895B2Publication Date: 2020-03-31
- Inventor: Qi Xie , Chiyu Zhu , Kiran Shrestha , Pauline Calka , Oreste Madia , Jan Willem Maes , Michael Eugene Givens
- Applicant: ASM IP Holding B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holdings B.V.
- Current Assignee: ASM IP Holdings B.V.
- Current Assignee Address: NL Almere
- Agency: Snell & Wilmer L.L.P.
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L29/49 ; H01L29/51 ; H01L27/092

Abstract:
A method for forming a semiconductor device structure is disclosure. The method may include, depositing an NMOS gate dielectric and a PMOS gate dielectric over a semiconductor substrate, depositing a first work function metal over the NMOS gate dielectric and over the PMOS gate dielectric, removing the first work function metal over the PMOS gate dielectric, and depositing a second work function metal over the NMOS gate dielectric and over the PMOS gate dielectric. Semiconductor device structures including desired metal gate electrodes deposited by the methods of the disclosure are also disclosed.
Public/Granted literature
- US20190088555A1 METHOD FOR FORMING A SEMICONDUCTOR DEVICE STRUCTURE AND RELATED SEMICONDUCTOR DEVICE STRUCTURES Public/Granted day:2019-03-21
Information query
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