Multilayer structure, method for producing same, packaging material and product including same, and protective sheet for electronic device
Abstract:
The present invention relates to a multilayer structure including a base (X), a layer (Y), and a layer (Z), wherein the layer (Y) contains an aluminum-containing compound (A), and the layer (Z) contains an organic phosphorus compound (BO) and a polymer (F) having an ether bond and having no glycosidic bond.
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