Invention Grant
- Patent Title: Substrate processing apparatus and method of manufacture using the same
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Application No.: US15595948Application Date: 2017-05-16
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Publication No.: US10651074B2Publication Date: 2020-05-12
- Inventor: Kyoung Hwan Kim , Taewoo Kang , Byung Lyul Park , Hyungjun Jeon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4e209848
- Main IPC: H01L21/683
- IPC: H01L21/683 ; B65G47/91 ; C23C16/458 ; H01L21/67 ; H01L21/687

Abstract:
A substrate processing apparatus may include a substrate jig device and a transfer unit, which is configured to hold a substrate in a non-contact state and move the substrate toward the substrate jig device. The substrate jig device may include a supporter, which is configured to support an edge of the substrate and have an opening, a first suction part, which overlaps with a center region of the opening and is configured to move in a first direction, and a plurality of second suction parts, which overlap with an edge region of the opening and are configured to move toward the opening. Here, the first direction may be a direction passing through the opening.
Public/Granted literature
- US20180114714A1 SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURE USING THE SAME Public/Granted day:2018-04-26
Information query
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