Invention Grant
- Patent Title: Bulk acoustic wave resonator on a stress isolated platform
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Application No.: US15857906Application Date: 2017-12-29
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Publication No.: US10651817B2Publication Date: 2020-05-12
- Inventor: Ting-Ta Yen , Brian Goodlin , Ricky Alan Jackson , Nicholas Stephen Dellas
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H03H9/02
- IPC: H03H9/02 ; B81C1/00 ; B81B7/00 ; H03H3/007 ; H03H9/17 ; H03H9/05 ; H03H9/10 ; H03H9/09
Abstract:
In described examples of a micromechanical system (MEMS), a rigid cantilevered platform is formed on a base substrate. The cantilevered platform is anchored to the base substrate by only a single anchor point. A MEMS resonator is formed on the cantilevered platform.
Public/Granted literature
- US20190207581A1 Bulk acoustic Wave Resonator on a Stress Isolated Platform Public/Granted day:2019-07-04
Information query
