Invention Grant
- Patent Title: Mutual inductance suppressor for crosstalk immunity enhancement
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Application No.: US16327453Application Date: 2016-10-01
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Publication No.: US10652999B2Publication Date: 2020-05-12
- Inventor: Khang Choong Yong , Jackson Chung Peng Kong , Bok Eng Cheah , Stephen H. Hall
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2016/055083 WO 20161001
- International Announcement: WO2018/063416 WO 20180405
- Main IPC: H05K1/02
- IPC: H05K1/02

Abstract:
Embodiments are generally directed to a mutual inductance suppressor for crosstalk immunity enhancement. An embodiment of a printed circuit board includes a first signal trace and a second signal trace on a first layer, wherein the first signal trace and second signal trace are non-intersecting; a second layer below the first layer, the second layer including a voltage reference plane; and a mutual inductance suppressor in the voltage reference plane, the mutual inductance suppressor including a serpentine portion of the voltage reference plane between the first signal trace and the second signal trace.
Public/Granted literature
- US20190215953A1 MUTUAL INDUCTANCE SUPPRESSOR FOR CROSSTALK IMMUNITY ENHANCEMENT Public/Granted day:2019-07-11
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