According to the present disclosure, an electronic component mounting device includes: a mounting head which picks up an electronic component from a part feeder, and transfers and mounts the electronic component on a board; a dispenser which applies a paste to a lower surface of the electronic component picked up by the mounting head, the paste being flied out from an ejection hole of the dispenser against gravity, the ejection hole opening upwardly; and a shield member which is disposed between the electronic component and the dispenser and has an opening above the ejection hole.