Invention Grant
- Patent Title: Endoscope and hardness adjustment device
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Application No.: US15345477Application Date: 2016-11-07
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Publication No.: US10653303B2Publication Date: 2020-05-19
- Inventor: Takuro Asaoka , Yoshihiro Ueda
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@460c5533
- Main IPC: A61B1/00
- IPC: A61B1/00 ; A61B1/005

Abstract:
Provided are an endoscope and a hardness adjustment device configured so that an arrangement space of built-in components in an operation portion can be ensured and that burden on a coil spring and a wire can be reduced. In an operation portion, a retained portion of a coil spring unit is retained at a first radial position by a coil spring holder as a first retainer, and a base end portion of a wire unit is retained at a second radial position by a wire holder as a second retainer. A base end portion of the coil spring unit is retained at a third radial position by a coil spring contact portion as a third retainer.
Public/Granted literature
- US20170127910A1 ENDOSCOPE AND HARDNESS ADJUSTMENT DEVICE Public/Granted day:2017-05-11
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