- 专利标题： Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
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申请号： US15208444申请日： 2016-07-12
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公开(公告)号： US10653332B2公开(公告)日： 2020-05-19
- 发明人: Bryan McGrane , Milan Raj , PingHung Wei , Briana Morey , Roozbeh Ghaffari , Monica Lin , Jeffrey Model , Xianyan Wang , Bryan Keen , Stephen Lee
- 申请人： MC10, Inc.
- 申请人地址： US MA Lexington
- 专利权人： MC10, Inc.
- 当前专利权人： MC10, Inc.
- 当前专利权人地址： US MA Lexington
- 代理机构： Nixon Peabody LLP
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H05K1/02 ; A61B5/0496 ; A61B5/00 ; A61B5/0476 ; A61B5/0488 ; A61B5/0492 ; A61B5/0478 ; A61B5/0408 ; A61B5/01 ; A61B5/0402 ; A61B5/053
摘要：
A device includes a flexible printed circuit board and one or more conductive stiffeners. The conductive stiffeners include a conductive surface that can be electrically connected to contact pads on the flexible printed circuit board. The wearable device can further include an adhesive layer or an encapsulation layer. The adhesive layer and the encapsulation layer can include conductive portions surrounded by non-conductive portions. The conductive portions can be aligned with the conductive stiffeners and together transmit electrical energy to the contact pads of the flexible printed circuit board.
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