公开(公告)号：US10709384B2

公开(公告)日：2020-07-14

申请号：US15238488

申请日：2016-08-16

申请人： MC10, Inc.

发明人： Hoi-Cheong Steve Sun ,  Milan Raj ,  Xianyan Wang ,  Brian Murphy ,  Valerie Susan Hanson

IPC分类号： G01K3/00 ,  A61B5/00 ,  G01K13/00 ,  G01K1/14 ,  A61B5/01 ,  G01K7/42 ,  G01K17/00

摘要： Wearable heat flux devices are disclosed that can detect heat flux based on evaporative cooling for determining a core body temperature of a user, and that can heat or cool a surface of a user for reaching a steady-state heat flux to determine the core body temperature of the user. Exemplary heat flux devices can include a heat flux sensor and a wicking layer. The heat flux sensor can be configured to detect heat flux at a location on a user. The wicking layer can be configured to absorb moisture at the location and to transport the moisture above the heat flux sensor. The heat flux subsequently detected by the heat flux sensor includes the evaporative cooling from the evaporation of the moisture.

公开(公告)号：US10410962B2

公开(公告)日：2019-09-10

申请号：US15108861

申请日：2015-01-06

申请人： MC10, Inc.

发明人： Nicholas McMahon ,  Xianyan Wang ,  Brian Elolampi ,  Bryan D. Keen ,  David G. Garlock

IPC分类号： H01H13/86 ,  H01L21/02 ,  H01L21/48 ,  H01L21/56 ,  H01L21/66 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538

摘要： Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) sensor systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal integrated circuit device is disclosed which includes a flexible substrate with electronic circuitry attached to the flexible substrate. A flexible encapsulation layer is attached to the flexible substrate. The flexible encapsulation layer encases the electronic circuitry between the flexible substrate and the encapsulation layer. For some configurations, the encapsulation layer and flexible substrate arc fabricated from stretchable and bendable non-conductive polymers. The electronic circuitry may comprise an integrated circuit sensor system with multiple device islands that are electrically and physically connected via a plurality of stretchable electrical interconnects.

公开(公告)号：US20170049397A1

公开(公告)日：2017-02-23

申请号：US15238488

申请日：2016-08-16

申请人： MC10, Inc.

发明人： Hoi-Cheong Steve Sun ,  Milan Raj ,  Xianyan Wang ,  Brian Murphy ,  Valerie Susan Hanson

IPC分类号： A61B5/00 ,  G01K1/14 ,  A61B5/01 ,  G01K13/00

CPC分类号： A61B5/6833 ,  A61B5/01 ,  G01K1/14 ,  G01K7/427 ,  G01K13/002 ,  G01K17/00

摘要： Wearable heat flux devices are disclosed that can detect heat flux based on evaporative cooling for determining a core body temperature of a user, and that can heat or cool a surface of a user for reaching a steady-state heat flux to determine the core body temperature of the user. Exemplary heat flux devices can include a heat flux sensor and a wicking layer. The heat flux sensor can be configured to detect heat flux at a location on a user. The wicking layer can be configured to absorb moisture at the location and to transport the moisture above the heat flux sensor. The heat flux subsequently detected by the heat flux sensor includes the evaporative cooling from the evaporation of the moisture.

摘要翻译： 公开了可穿戴热通量装置，其可以基于用于确定使用者的核心体温的蒸发冷却来检测热通量，并且可以加热或冷却使用者的表面达到稳态热通量以确定核心体温 的用户。 示例性的热通量装置可以包括热通量传感器和芯吸层。 热通量传感器可以被配置为检测用户位置处的热通量。 芯吸层可以被配置成吸收该位置处的水分并将热量传递到热通量传感器上方。 随后由热通量传感器检测到的热通量包括来自水分蒸发的蒸发冷却。

公开(公告)号：US20180111353A1

公开(公告)日：2018-04-26

申请号：US15850523

申请日：2017-12-21

申请人： MC10, Inc.

发明人： Gilbert Lee Huppert ,  Xianyan Wang ,  Roozbeh Ghaffari ,  Pinghung Wei ,  Ji Hyung Suzy Hong ,  Hakan Mutlu ,  Brian Murphy ,  David G. Garlock

IPC分类号： B32B7/12 ,  B32B27/40 ,  B32B5/02 ,  B32B5/18 ,  B32B25/12 ,  B32B27/30

CPC分类号： B32B7/12 ,  B32B5/022 ,  B32B5/024 ,  B32B5/18 ,  B32B25/12 ,  B32B27/308 ,  B32B27/40 ,  B32B2262/0253 ,  B32B2307/702 ,  B32B2535/00 ,  B32B2556/00

摘要： The present invention describes multilayered adhesive structures that can be used as adhesives to mount wearable devices onto the skin. The multilayered adhesive structures can comprise a buffer layer sandwiched between two adhesive layers, a first adhesive layer adhering the multilayered adhesive structure to the wearable device and a second adhesive layer adhering the buffer layer to the skin. The buffer layer separates or isolates the wearable device from the skin. By mechanically buffering the wearable device from the skin, the multilayered adhesive structures permit the devices to be skin-mounted for an extended period of time (e.g., a few hours or days) without causing moisture-associated skin injuries such as erythema, maceration, and irritation or inflammation.

公开(公告)号：US20170019988A1

公开(公告)日：2017-01-19

申请号：US15208444

申请日：2016-07-12

申请人： MC10, Inc.

发明人： Bryan McGrane ,  Milan Raj ,  PingHung Wei ,  Briana Morey ,  Roozbeh Ghaffari ,  Monica Lin ,  Jeffrey Model ,  Xianyan Wang ,  Bryan Keen ,  Stephen Lee

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/06 ,  H05K1/09 ,  H05K1/03 ,  A61B5/0496 ,  A61B5/00 ,  A61B5/01 ,  A61B5/0402 ,  A61B5/0476 ,  A61B5/0488 ,  H05K1/18 ,  H05K3/18

CPC分类号： A61B5/0496 ,  A61B5/01 ,  A61B5/0402 ,  A61B5/0408 ,  A61B5/0476 ,  A61B5/0478 ,  A61B5/0488 ,  A61B5/0492 ,  A61B5/053 ,  A61B5/6801 ,  A61B2562/164 ,  A61B2562/166 ,  H05K1/0209 ,  H05K1/0283 ,  H05K1/189 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10401 ,  H05K2201/2009 ,  H05K2203/1327

摘要： A wearable device includes a flexible printed circuit board and one or more conductive stiffeners. The conductive stiffeners include a conductive surface that can be electrically or thermally connected to contact pads on the flexible printed circuit board. The wearable device can further include an adhesive layer or an encapsulation layer. The adhesive layer and the encapsulation layer can include conductive portions surrounded by non-conductive portions. The conductive portions can be aligned with the conductive stiffeners and together transmit electrical and/or thermal energy to the contact pads of the flexible printed circuit board.

摘要翻译： 可佩戴装置包括柔性印刷电路板和一个或多个导电加强件。 导电加强件包括导电表面，其可以电连接或热连接到柔性印刷电路板上的接触焊盘。 可穿戴装置还可包括粘合剂层或包封层。 粘合剂层和包封层可以包括被非导电部分包围的导电部分。 导电部分可以与导电加强件对准，并且一起将电和/或热能传递到柔性印刷电路板的接触垫。

公开(公告)号：US20160361015A1

公开(公告)日：2016-12-15

申请号：US15183513

申请日：2016-06-15

申请人： MC10, Inc.

发明人： Xianyan Wang ,  Roozbeh Ghaffari ,  Pinghung Wei ,  Ji Hyung Suzy Hong ,  Hakan Mutlu ,  Brian Murphy ,  David G. Garlock

IPC分类号： A61B5/00 ,  B32B3/16 ,  B32B27/10 ,  B32B27/18 ,  B32B27/08 ,  B32B7/12 ,  B32B27/26

CPC分类号： A61B5/68335 ,  A61B5/01 ,  A61B5/0402 ,  A61B5/0476 ,  A61B5/0488 ,  A61B5/0531 ,  A61B5/0533 ,  A61B5/0816 ,  A61B5/11 ,  A61B5/4875 ,  A61B5/6832 ,  B32B3/16 ,  B32B3/266 ,  B32B5/022 ,  B32B5/024 ,  B32B5/026 ,  B32B5/18 ,  B32B7/12 ,  B32B25/08 ,  B32B25/12 ,  B32B25/14 ,  B32B25/20 ,  B32B27/08 ,  B32B27/10 ,  B32B27/18 ,  B32B27/26 ,  B32B27/308 ,  B32B27/40 ,  B32B29/00 ,  B32B2262/0253 ,  B32B2262/0261 ,  B32B2262/0276 ,  B32B2262/12 ,  B32B2262/14 ,  B32B2264/108 ,  B32B2307/546 ,  B32B2307/702 ,  B32B2307/726 ,  B32B2307/732 ,  B32B2457/00 ,  B32B2535/00 ,  B32B2556/00 ,  C09J7/29 ,  C09J2201/128

摘要： The present invention describes breathable multilayered adhesive structures that can be used as adhesives to mount devices onto the skin. The breathable multilayered adhesive structures can comprise moisture-wicking layers adhered to the skin by a porous adhesion layer. The pores allow moisture released from the skin to be transferred away through the moisture-wicking layer. The adhesive structures permit the devices to be skin-mounted for an extended period of time (e.g., a few hours or days) without causing moisture-associated skin injuries such as erythema, maceration, and irritation or inflammation.

摘要翻译： 本发明描述了可用作粘合剂以将装置安装到皮肤上的透气多层粘合剂结构。 透气多层粘合剂结构可以包括通过多孔粘合层粘附到皮肤的吸湿层。 毛孔允许从皮肤释放的水分通过吸湿层转移出去。 粘合剂结构允许装置长时间（例如几小时或几天）皮肤安装，而不会引起与湿气相关的皮肤损伤如红斑，浸渍，刺激或炎症。

公开(公告)号：US10653332B2

公开(公告)日：2020-05-19

申请号：US15208444

申请日：2016-07-12

申请人： MC10, Inc.

发明人： Bryan McGrane ,  Milan Raj ,  PingHung Wei ,  Briana Morey ,  Roozbeh Ghaffari ,  Monica Lin ,  Jeffrey Model ,  Xianyan Wang ,  Bryan Keen ,  Stephen Lee

IPC分类号： H05K1/18 ,  H05K1/02 ,  A61B5/0496 ,  A61B5/00 ,  A61B5/0476 ,  A61B5/0488 ,  A61B5/0492 ,  A61B5/0478 ,  A61B5/0408 ,  A61B5/01 ,  A61B5/0402 ,  A61B5/053

摘要： A device includes a flexible printed circuit board and one or more conductive stiffeners. The conductive stiffeners include a conductive surface that can be electrically connected to contact pads on the flexible printed circuit board. The wearable device can further include an adhesive layer or an encapsulation layer. The adhesive layer and the encapsulation layer can include conductive portions surrounded by non-conductive portions. The conductive portions can be aligned with the conductive stiffeners and together transmit electrical energy to the contact pads of the flexible printed circuit board.