Invention Grant
- Patent Title: Bondline sensors
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Application No.: US15585096Application Date: 2017-05-02
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Publication No.: US10656074B2Publication Date: 2020-05-19
- Inventor: Morteza Safai , Kimberly D. Meredith
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Yee & Associates, P.C.
- Main IPC: B32B41/00
- IPC: B32B41/00 ; G01N19/04 ; G01N25/72 ; G01M5/00

Abstract:
A bondline characteristic determination system comprises a plurality of graphene sensors and a plurality of graphene lines. The plurality of graphene sensors is positioned within a bondline of a composite structure. The plurality of graphene sensors is formed of graphene doped with a noble gas. The plurality of graphene lines electrically connects the plurality of graphene sensors external to the composite structure.
Public/Granted literature
- US20180321134A1 Bondline Sensors Public/Granted day:2018-11-08
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