Invention Grant
- Patent Title: Probe connector for a probing pad structure around a thermal attach mounting hole
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Application No.: US16410852Application Date: 2019-05-13
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Publication No.: US10656177B2Publication Date: 2020-05-19
- Inventor: Vikas Rao , Navneet K. Singh , Naveen G
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: G01R1/04
- IPC: G01R1/04 ; G01R1/073

Abstract:
A system includes a probe connector including first traces coupled to first conductors curvilinearly arranged around a first elongated portion of the probe connector. The system further includes a circuit board including second traces coupled to first connector pads curvilinearly arranged around a first hole in the circuit board. The first connector pads are to couple to the first conductors of the probe connector when the first elongated portion is inserted in the first hole. The system further comprises a first integrated circuit disposed on the circuit board, the first integrated circuit being coupled to the second traces.
Public/Granted literature
- US20190271720A1 PROBE CONNECTOR FOR A PROBING PAD STRUCTURE AROUND A THERMAL ATTACH MOUNTING HOLE Public/Granted day:2019-09-05
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