The various implementations described herein include systems and devices that comprise a cooling structure. In one aspect, a camera system comprises a cooling structure made from a thermally conductive material. The cooling structure has an exterior surface, an interior surface, a hollow portion, and a sidewall. The sidewall includes a through hole that penetrates the sidewall. The exterior surface includes surface features and is configured to radiate away from the cooling structure heat generated within the hollow portion that is transmitted from the interior surface to the exterior surface. The camera system further comprises a camera contained within the hollow portion of the cooling structure, a first electrical component that is embedded in the through hole, electrical components contained within the hollow portion, and an external housing that at least partially encloses the cooling structure.