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公开(公告)号：US11353158B2
公开(公告)日：2022-06-07
申请号：US17328501
申请日：2021-05-24
Applicant: Google LLC
Inventor： Arun Raghupathy , Benjamin Niewood , Cheng-Jung Lee , Adam Scott Kilgore
IPC: H04N5/225 , F16M11/20 , F16M13/00 , F16M11/10 , F16M13/02 , F16M11/14 , G03B17/08 , G03B17/55 , H04N7/18 , H05K7/20 , F16M11/04 , F16M11/06 , A47B97/00 , G03B17/56 , F21V21/30 , F21V21/088 , F16M11/38
Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.
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3.发明授权公开(公告)号：US10240713B2
公开(公告)日：2019-03-26
申请号：US15714894
申请日：2017-09-25
Applicant: GOOGLE LLC
Inventor： Adam Scott Kilgore , Adam Duckworth Mittleman
IPC: F16M11/08 , F16M11/16 , F16M13/00 , G03B17/56 , H04N5/225 , F16M11/20 , F16M13/02 , F16B1/00 , F16M11/24 , F16M11/32
Abstract: This application discloses a stand assembly that includes an upper portion for holding electronic components and a lower portion for supporting the upper portion. The lower portion including a base, a joint, and a second fastener structure configured to mate with a first fastener structure of the upper portion. The first fastener structure and the joint are configured to respectively provide a first degree of freedom of motion and a second degree of freedom of motion of the upper portion with respect to the lower portion. Movement of the upper portion at the first degree of freedom has substantially consistent resistance through first part of a first full range of motion associated with the first degree of freedom of motion. Movement of the upper portion at the second degree of freedom has substantially consistent resistance through a second full range of motion associated with the second degree of freedom.
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公开(公告)号：US10180615B2
公开(公告)日：2019-01-15
申请号：US15339839
申请日：2016-10-31
Applicant: GOOGLE LLC
Inventor： Adam Scott Kilgore , Amber Luttmann Volmering
Abstract: This application is directed to controlling a camera that includes an electrochromic glass layer. The electrochromic glass layer is disposed in front of a sensor array of the camera and has optical transmission properties that are responsive to voltage applied to the electrochromic glass layer. In accordance with a determination to transition the camera mode to a Day mode, a camera controller generates a first voltage, which is then applied to the electrochromic glass layer to cause the lens assembly to enter a first transmission state. In response to the first voltage, the electrochromic glass layer removes a substantial portion of a predefined band of infrared wavelengths in ambient light incident on the camera, and simultaneously passes by the electrochromic glass layer a substantial portion of visible wavelengths in the ambient light, thereby exposing the sensor array to the substantial portion of the visible wavelengths of the ambient light.
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公开(公告)号：USD822749S1
公开(公告)日：2018-07-10
申请号：US29530172
申请日：2015-06-14
Applicant: GOOGLE LLC
Designer： Rochus Jacob , Francois Rybarczyk , Adam Scott Kilgore , Adam Duckworth Mittleman , Jason Evans Goulden
CPC classification number: F16M11/2064 , A47B97/00 , A47B2097/003 , F16B1/00 , F16B2001/0035 , F16M11/041 , F16M11/08 , F16M11/105 , F16M11/16 , F16M11/2014 , F16M11/22 , F16M11/242 , F16M13/02 , F16M13/022 , G03B17/561 , H04N5/2251 , H04N5/2253 , H04N5/2257
Abstract: This application discloses a stand assembly that includes a receiving element for physically receiving a module, and a base assembly for supporting the receiving element. The receiving element further includes a module holding structure, an extended portion, and a first fastener structure coupled to an end of the extended portion. The base assembly includes a base, and a second fastener structure coupled to the base at a joint and configured to mate with the first fastener structure. The first fastener structure and the joint are configured to respectively provide a first degree of freedom of motion and a second degree of freedom of motion of the receiving element with respect to the base. The movement of the receiving element at the first degree of freedom has substantially consistent resistance through first part of a first full range of motion associated with the first degree of freedom of motion.
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Patent Agency Ranking
公开(公告)号：US20220221101A1
公开(公告)日：2022-07-14
申请号：US17657733
申请日：2022-04-01
Applicant: Google LLC
Inventor： Arun Raghupathy , Benjamin Niewood , Cheng-Jung Lee , Adam Scott Kilgore
IPC: F16M11/20 , F16M13/00 , F16M11/10 , F16M13/02 , F16M11/14 , G03B17/08 , G03B17/55 , H04N5/225 , H04N7/18 , H05K7/20
Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.
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公开(公告)号：US09939859B2
公开(公告)日：2018-04-10
申请号：US15073565
申请日：2016-03-17
Applicant: GOOGLE LLC
Inventor： Adam Scott Kilgore , Andrea Chantal Ashwood
CPC classification number: G06F1/203 , G05B2219/2642 , G08B13/19619 , H04N5/2252 , H04N5/2254 , H04N5/2257
Abstract: This application discloses an electronic device including a cooling structure and a plurality of electrical components. The cooling structure is made from a thermally conductive material, and has an exterior surface, an interior surface and a hollow portion defined by the interior surface. The exterior surface is configured to radiate away heat generated within the hollow portion that is transmitted from the interior surface to the exterior surface. The electrical components are contained within the hollow portion. Heat generated by the electrical components during operation of the electronic device is carried away by the cooling structure. In some implementations, the exterior surface includes a base form and a plurality of surface features that project away from the base form, and the surface features are physically configured to form a helical structure that wraps around the cooling structure and increases rate of thermal radiation from the exterior surface.
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公开(公告)号：USD1013758S1
公开(公告)日：2024-02-06
申请号：US29740738
申请日：2020-07-07
Applicant: GOOGLE LLC
Designer： Rochus Emmanuel Jacob , Samuel Ward Kortz , Jason Evans Goulden , Adam Scott Kilgore , Rafat E. Mehdi , Mi Zhou , Benjamin Zachary Niewood , Amber Luttmann Volmering , Minjung Kim
Abstract: FIG. 1 is a top and front perspective view of a camera showing our new design;
FIG. 2 is a bottom and front perspective view thereof;
FIG. 3 is a top and rear perspective view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right-side elevational view thereof;
FIG. 7 is a left-side elevational view thereof;
FIG. 8 is a rear elevational view thereof; and,
FIG. 9 is a front elevational view thereof.
The broken lines depict portions of the camera in which the design is embodied that form no part of the claimed design.-
公开(公告)号：US11035517B2
公开(公告)日：2021-06-15
申请号：US16903049
申请日：2020-06-16
Applicant: GOOGLE LLC
Inventor： Arun Raghupathy , Benjamin Niewood , Cheng-Jung Lee , Adam Scott Kilgore
IPC: H04N5/225 , F16M11/20 , F16M13/00 , F16M11/10 , F16M13/02 , F16M11/14 , G03B17/08 , G03B17/55 , H04N7/18 , H05K7/20 , F16M11/04 , F16M11/06 , A47B97/00 , G03B17/56 , F21V21/30 , F21V21/088 , F16M11/38
Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.
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