Invention Grant
- Patent Title: Moveable edge coupling ring for edge process control during semiconductor wafer processing
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Application No.: US14705430Application Date: 2015-05-06
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Publication No.: US10658222B2Publication Date: 2020-05-19
- Inventor: Haoquan Yan , Robert Griffith O'Neill , Raphael Casaes , Jon McChesney , Alex Paterson
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: LAM RESEARCH CORPORATION
- Current Assignee: LAM RESEARCH CORPORATION
- Current Assignee Address: US CA Fremont
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01L21/67 ; H01J37/32 ; H01J37/02 ; H01J37/20

Abstract:
A substrate processing system includes a processing chamber and a pedestal arranged in the processing chamber. An edge coupling ring is arranged adjacent to a radially outer edge of the pedestal. A first actuator is configured to selectively move the edge coupling ring to a raised position, relative to the pedestal to provide clearance between the edge coupling ring and the pedestal to allow a robot arm to remove the edge coupling ring from the processing chamber.
Public/Granted literature
- US20160211166A1 MOVEABLE EDGE COUPLING RING FOR EDGE PROCESS CONTROL DURING SEMICONDUCTOR WAFER PROCESSING Public/Granted day:2016-07-21
Information query
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