Invention Grant
- Patent Title: Electrical device terminal finishing
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Application No.: US16104049Application Date: 2018-08-16
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Publication No.: US10658278B2Publication Date: 2020-05-19
- Inventor: Sreenivasan K Koduri
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/56 ; H01L23/31 ; H01L21/48 ; H01L23/00

Abstract:
In described examples, a terminal (e.g., a conductive terminal) includes a base material, a plating stack and a solder finish. The base material can be a metal, such as copper. The plating stack is arranged on a surface of the base material, and includes breaks in the plating stack. The breaks in the plating stack extend from a first surface of the plating stack to a second surface of the plating stack adjacent to the surface of the base material. The solder finish is coated over the breaks in the plating stack.
Public/Granted literature
- US20200058576A1 ELECTRICAL DEVICE TERMINAL FINISHING Public/Granted day:2020-02-20
Information query
IPC分类: