Invention Grant
- Patent Title: Semiconductor structures including multi-portion liners
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Application No.: US15857873Application Date: 2017-12-29
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Publication No.: US10658580B2Publication Date: 2020-05-19
- Inventor: Kyle B. Campbell , Irina Vasilyeva , Farrell M. Good , Vishwanath Bhat , Kyuchul Chong
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24 ; H01L21/768
Abstract:
A method of forming a semiconductor structure. The method comprises forming a protective portion of a liner on at least a portion of stack structures on a substrate. The protective portion comprises a material formulated to adhere to the stack structures. A conformal portion of the liner is formed on the protective portion of the liner or on the protective portion of the liner and exposed materials of the stack structures. At least one of the protective portion and the conformal portion does not comprise aluminum. Additional methods of forming a semiconductor structure are disclosed, as are semiconductor structures including the liners comprising the protective portion and the conformal portion.
Public/Granted literature
- US20180123036A1 SEMICONDUCTOR STRUCTURES INCLUDING MULTI-PORTION LINERS Public/Granted day:2018-05-03
Information query
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