发明授权
- 专利标题: Elastic wave device
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申请号: US15831471申请日: 2017-12-05
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公开(公告)号: US10659001B2公开(公告)日: 2020-05-19
- 发明人: Koji Yamamoto , Tsutomu Takai , Seiji Kai , Hisashi Yamazaki , Yuji Miwa , Takashi Yamane
- 申请人: Murata Manufacturing Co., Ltd.
- 申请人地址: JP Kyoto
- 专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人地址: JP Kyoto
- 代理机构: Keating & Bennett, LLP
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7337aba0
- 主分类号: H03H9/02
- IPC分类号: H03H9/02 ; H03H9/10 ; H03H9/64 ; H03H9/145 ; H03H9/25
摘要:
An elastic wave device includes a lamination layer film including a piezoelectric thin film on a support substrate. The lamination layer film is not partially present in a region located in an outer side portion of a region where IDT electrodes are provided. A first insulation layer extends from at least a portion of a region where the lamination layer film is not present to an upper portion of the piezoelectric thin film. A wiring electrode extends from the upper portion of the piezoelectric thin film to an upper portion of the first insulation layer, and extends onto a section of the first insulation layer in the region.
公开/授权文献
- US20180097502A1 ELASTIC WAVE DEVICE 公开/授权日:2018-04-05
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