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公开(公告)号：US10659002B2
公开(公告)日：2020-05-19
申请号：US16108165
申请日：2018-08-22
发明人： Koji Yamamoto , Tsutomu Takai , Seiji Kai , Hisashi Yamazaki , Yuji Miwa , Takashi Yamane , Noriyoshi Ota , Atsushi Tanaka
摘要： An elastic wave device includes a lamination layer film including a piezoelectric thin film on a support substrate. The lamination layer film is not partially present in a region located in an outer side portion of a region where IDT electrodes are provided. A first insulation layer extends from at least a portion of a region where the lamination layer film is not present to an upper portion of the piezoelectric thin film. A wiring electrode has a width of about 6 μm and extends from the upper portion of the piezoelectric thin film to an upper portion of the first insulation layer, and extends onto a section of the first insulation layer in the region.
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2.发明授权公开(公告)号：US10250220B2
公开(公告)日：2019-04-02
申请号：US15014239
申请日：2016-02-03
发明人： Yuji Miwa , Hijiri Sumii , Junpei Yasuda , Taku Kikuchi , Hisashi Yamazaki
摘要： An elastic wave device includes a piezoelectric substrate, an IDT electrode, wiring, a pad, an under bump metal, a first dielectric layer, and a second dielectric layer. At least a portion of the IDT electrode includes a first electrically conductive film, at least a portion of the wiring includes a multilayer body including the first electrically conductive film and a second electrically conductive film, and at least a portion of the pad includes the second electrically conductive film. The second dielectric layer covers the region other than the contact region between the second electrically conductive film and the under bump metal. Consequently, the second electrically conductive film is covered with the second dielectric layer and the under bump metal and is not exposed to air.
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公开(公告)号：US10659001B2
公开(公告)日：2020-05-19
申请号：US15831471
申请日：2017-12-05
发明人： Koji Yamamoto , Tsutomu Takai , Seiji Kai , Hisashi Yamazaki , Yuji Miwa , Takashi Yamane
摘要： An elastic wave device includes a lamination layer film including a piezoelectric thin film on a support substrate. The lamination layer film is not partially present in a region located in an outer side portion of a region where IDT electrodes are provided. A first insulation layer extends from at least a portion of a region where the lamination layer film is not present to an upper portion of the piezoelectric thin film. A wiring electrode extends from the upper portion of the piezoelectric thin film to an upper portion of the first insulation layer, and extends onto a section of the first insulation layer in the region.
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公开(公告)号：US10320362B2
公开(公告)日：2019-06-11
申请号：US15171181
申请日：2016-06-02
发明人： Taku Kikuchi , Shin Saijo , Hisashi Yamazaki , Masahiro Fukushima , Yuji Miwa
IPC分类号： H03H9/05 , H03H3/08 , H03H9/10 , H01L41/047 , H03H9/145
摘要： An elastic wave device includes a multilayer film provided on a support substrate and including a piezoelectric thin film and a layer other than the piezoelectric thin film, an interdigital transducer electrode provided on one surface of the piezoelectric thin film, and an external connection terminal electrically connected to the interdigital transducer electrode. In a plan view, the multilayer film is partially absent or omitted in a region outside a region where the interdigital transducer electrode is provided, and the elastic wave device further includes a first insulating layer provided on the support substrate in at least a portion of a region where the multilayer film is absent or omitted.
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公开(公告)号：US20180097502A1
公开(公告)日：2018-04-05
申请号：US15831471
申请日：2017-12-05
发明人： Koji Yamamoto , Tsutomu Takai , Seiji Kai , Hisashi Yamazaki , Yuji Miwa , Takashi Yamane
CPC分类号： H03H9/145 , H03H9/02574 , H03H9/02897 , H03H9/1071 , H03H9/178 , H03H9/25 , H03H9/547
摘要： An elastic wave device includes a lamination layer film including a piezoelectric thin film on a support substrate. The lamination layer film is not partially present in a region located in an outer side portion of a region where IDT electrodes are provided. A first insulation layer extends from at least a portion of a region where the lamination layer film is not present to an upper portion of the piezoelectric thin film. A wiring electrode extends from the upper portion of the piezoelectric thin film to an upper portion of the first insulation layer, and extends onto a section of the first insulation layer in the region.
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