Invention Grant
- Patent Title: MEMS element, sealing structure, electronic device, electronic apparatus, and vehicle
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Application No.: US15961564Application Date: 2018-04-24
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Publication No.: US10662055B2Publication Date: 2020-05-26
- Inventor: Takashi Yamazaki , Akihiko Ebina , Osamu Kawauchi , Yoshihiko Yokoyama
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@173cc52f com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7a88d3cf com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4e0f13ac com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@277b2138 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@561f8d45 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6ab53ae2
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00
Abstract:
A MEMS element includes a surface silicon layer on which an element is formed and on which a first electrode and a second electrode as element electrodes and an electrode pad connected to the first electrode and the second electrode are disposed, and in which a first wiring through-hole is disposed at a position overlapping with the electrode pad of the surface silicon layer and a wiring electrode electrically connected to the electrode pad is disposed in the first wiring through-hole, in plan view.
Public/Granted literature
- US20180312395A1 MEMS ELEMENT, SEALING STRUCTURE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND VEHICLE Public/Granted day:2018-11-01
Information query
