Invention Grant
- Patent Title: Micro-electro-mechanical-systems processing method, and micro-electro-mechanical-systems processing apparatus
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Application No.: US16015640Application Date: 2018-06-22
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Publication No.: US10662059B2Publication Date: 2020-05-26
- Inventor: Keiji Watanabe , Hiroyasu Shichi , Misuzu Sagawa , Toshiyuki Mine , Daisuke Ryuzaki
- Applicant: HITACHI, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI, LTD.
- Current Assignee: HITACHI, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@267196fe
- Main IPC: B81C99/00
- IPC: B81C99/00 ; H01J37/317 ; H01J37/304 ; H01J37/147 ; G03F7/20 ; B81C1/00 ; H01J37/305

Abstract:
The invention is to reduce non-uniformity of a processing shape over a wide range of a single field-of-view.The invention is directed to a method of processing micro electro mechanical systems with a first step and a second step in a processing apparatus including an irradiation unit that irradiates a sample with a charged particle beam, a shape measuring unit that measures a shape of the sample, and a control unit. In the first step, the irradiation unit irradiates a plurality of single field-of-view points with the charged particle beam in a first region of the sample, the shape measuring unit measures the shape of a spot hole formed in the first region of the sample, and the control unit sets, based on measurement results of the shape of the spot hole, a scan condition of the charged particle beam or a forming mask of the charged particle beam at each of the single field-of-view points. In the second step, the irradiation unit irradiates, based on the scan condition or the forming mask set in the first step, a second region of the sample with the charged particle beam.
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