Invention Grant
- Patent Title: Manufacturing method of heat conducting device
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Application No.: US15615140Application Date: 2017-06-06
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Publication No.: US10663231B2Publication Date: 2020-05-26
- Inventor: Li-Kuang Tan , Shih-Kang Lin
- Applicant: DELTA ELECTRONICS, INC.
- Applicant Address: TW Taoyuan
- Assignee: DELTA ELECTRONICS, INC.
- Current Assignee: DELTA ELECTRONICS, INC.
- Current Assignee Address: TW Taoyuan
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@46891c00
- Main IPC: F28D15/02
- IPC: F28D15/02 ; F28D15/04 ; H01L23/373 ; H01L21/48 ; H01L23/427 ; B23P15/26 ; H01L23/367

Abstract:
A manufacturing method of a heat conducting device includes following steps: providing a first plate, which includes a plate body and at least a heat conducting element, wherein the plate body has at least an inserting end disposed corresponding to the heat conducting element and defining a tube, and the heat conducting element is mounted at the tube; providing a second plate, which has a first opening end; disposing a first wick structure on an internal wall of the heat conducting element and a bottom surface of the plate body; disposing a second wick structure on an internal wall of the second plate; and connecting the plate body to the first opening end so as to connect the first plate and the second plate to form a chamber. Accordingly, the heat conducting device has a higher heat conducting efficiency.
Public/Granted literature
- US20170356694A1 MANUFACTURING METHOD OF HEAT CONDUCTING DEVICE Public/Granted day:2017-12-14
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