公开(公告)号：US12284784B2

公开(公告)日：2025-04-22

申请号：US17887669

申请日：2022-08-15

Applicant: Delta Electronics, Inc.

Inventor： Shih-Kang Lin ,  Li-Kuang Tan

IPC: H05K7/20 ,  F04B53/16 ,  F04B53/22

Abstract: A hot-swappable pump unit (HSPU) and a coolant distribution unit (CDU) using the same are disclosed. The HSPU is connected to a loop inlet element, a loop outlet element and a fixed component of CDU along a matching direction. The HSPU includes a housing, a pump, a pump inlet element, a pump outlet element and a fastening component. The pump inlet element is in communication with the pump by passing through a first lateral wall of the housing. The pump outlet element is in communication with the pump by passing through the first lateral wall. The fastening component is arranged on the housing and configured to engage with the fixed component, to drive the hosing to move along the matching direction. Whereby, the pump inlet element and the loop outlet element are matched and connected, and the pump outlet element and the loop inlet element are matched and connected.

公开(公告)号：US20230059922A1

公开(公告)日：2023-02-23

申请号：US17887669

申请日：2022-08-15

Applicant: Delta Electronics, Inc.

Inventor： Shih-Kang Lin ,  Li-Kuang Tan

IPC: H05K7/20 ,  F04B53/22 ,  F04B53/16

Abstract: A hot-swappable pump unit (HSPU) and a coolant distribution unit (CDU) using the same are disclosed. The HSPU is connected to a loop inlet element, a loop outlet element and a fixed component of CDU along a matching direction. The HSPU includes a housing, a pump, a pump inlet element, a pump outlet element and a fastening component. The pump inlet element is in communication with the pump by passing through a first lateral wall of the housing. The pump outlet element is in communication with the pump by passing through the first lateral wall. The fastening component is arranged on the housing and configured to engage with the fixed component, to drive the hosing to move along the matching direction. Whereby, the pump inlet element and the loop outlet element are matched and connected, and the pump outlet element and the loop inlet element are matched and connected.

公开(公告)号：US11971219B2

公开(公告)日：2024-04-30

申请号：US17695333

申请日：2022-03-15

Applicant: DELTA ELECTRONICS, INC.

Inventor： Li-Kuang Tan ,  Shih-Kang Lin

IPC: F28D15/02 ,  F21V29/74 ,  F21Y115/10 ,  F28D15/04 ,  F28D21/00 ,  F28F3/06 ,  F28F9/007 ,  H01L23/367 ,  H01L23/427 ,  H01L33/64

CPC classification number: F28D15/0275 ,  F28D15/0233 ,  F28D15/04 ,  F28F3/06 ,  H01L23/427 ,  H01L33/64 ,  F21V29/74 ,  F21Y2115/10 ,  F28D2021/0028 ,  F28F9/0075 ,  F28F2275/08 ,  H01L23/3672

Abstract: A heat dissipation device includes at least a temperature plate and a cooling fin assembly. The temperature plate includes a plate body and a supporter. The plate body includes a vacuum chamber and a first external surface. The plate body is bent to form at least a bent portion with the first external surface being a compressive side, and the supporter is disposed at the bent portion. The supporter is disposed inside the vacuum chamber and connected to an inner wall of the vacuum chamber. The cooling fin assembly is disposed on the first external surface.

公开(公告)号：US11543188B2

公开(公告)日：2023-01-03

申请号：US16742203

申请日：2020-01-14

Applicant: DELTA ELECTRONICS, INC.

Inventor： Li-Kuang Tan ,  Shih-Kang Lin ,  Kuo-Ying Lee ,  Ting-Yuan Wu ,  Chao-Wen Lu

IPC: F28D15/02 ,  F28D15/04 ,  H05K7/20 ,  F28D21/00

Abstract: A temperature plate device includes a plate body and a bent structure. The plate body includes a first plate and a second plate. A chamber is defined by the first plate and the second plate. The first plate has a first step section. The second plate has a second step section corresponding to the first step section. The bent structure is connected to and traverses the first step section between the first step section and the second step section.

公开(公告)号：US11306974B2

公开(公告)日：2022-04-19

申请号：US15624300

申请日：2017-06-15

Applicant: DELTA ELECTRONICS, INC.

Inventor： Li-Kuang Tan ,  Shih-Kang Lin

IPC: F28D15/02 ,  F28D15/04 ,  F28F3/06 ,  H01L33/64 ,  H01L23/427 ,  F28F9/007 ,  F28D21/00 ,  F21V29/74 ,  F21Y115/10 ,  H01L23/367

Abstract: A temperature plate includes a plate body and at least two supporters. The plate body has a first plate and a second plate, and a vacuum chamber is defined by the first plate and the second plate. The first plate has a first external surface, and the plate body is bent to form at least two bent portions with the first external surface being a compressive side, and the supporters are disposed inside the vacuum chamber and connected to an inner wall of the vacuum chamber to enhance a structural strength of the bent portions and also to improve heat conduction, wherein the temperature plate is combined with a cooling fin assembly, the cooling fin assembly is disposed on the first external surface. When the number of the bent portions are two, the configuration of the two bent portions allows the plate body to clip the cooling fin assembly.

公开(公告)号：US10663231B2

公开(公告)日：2020-05-26

申请号：US15615140

申请日：2017-06-06

Applicant: DELTA ELECTRONICS, INC.

Inventor： Li-Kuang Tan ,  Shih-Kang Lin

IPC: F28D15/02 ,  F28D15/04 ,  H01L23/373 ,  H01L21/48 ,  H01L23/427 ,  B23P15/26 ,  H01L23/367

Abstract: A manufacturing method of a heat conducting device includes following steps: providing a first plate, which includes a plate body and at least a heat conducting element, wherein the plate body has at least an inserting end disposed corresponding to the heat conducting element and defining a tube, and the heat conducting element is mounted at the tube; providing a second plate, which has a first opening end; disposing a first wick structure on an internal wall of the heat conducting element and a bottom surface of the plate body; disposing a second wick structure on an internal wall of the second plate; and connecting the plate body to the first opening end so as to connect the first plate and the second plate to form a chamber. Accordingly, the heat conducting device has a higher heat conducting efficiency.