Invention Grant
- Patent Title: Substrate cleaning apparatus and substrate processing facility having the same
-
Application No.: US15392008Application Date: 2016-12-28
-
Publication No.: US10665477B2Publication Date: 2020-05-26
- Inventor: Tea-Geon Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee IP Law, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7b746ccc
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B1/02 ; B08B3/14 ; B08B3/12 ; B08B3/04 ; B08B1/00 ; B08B1/04 ; B08B3/10 ; B08B3/00

Abstract:
A substrate cleaning apparatus includes a porous suction part having a polygonal pillar shape with a plurality of cleaning surfaces, a transfer unit to transfer a substrate with a plurality of semiconductor devices toward the porous suction part, and to contact the semiconductor devices with one of the plurality of cleaning surfaces, and a rotation driving part to rotate the porous suction part.
Public/Granted literature
- US20170250095A1 SUBSTRATE CLEANING APPARATUS AND SUBSTRATE PROCESSING FACILITY HAVING THE SAME Public/Granted day:2017-08-31
Information query
IPC分类: