公开(公告)号：US20250118616A1

公开(公告)日：2025-04-10

申请号：US18608315

申请日：2024-03-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tea-Geon Kim

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L25/065

Abstract: A semiconductor package includes a package substrate, a semiconductor chip on the package substrate, a molding layer on a top surface of the package substrate and covering a side surface and a top surface of the semiconductor chip, and a heat dissipation structure on the molding layer. The heat dissipation structure includes a plurality of concave portions facing the top surface of the package substrate. The heat dissipation structure includes a carbon nanotube and a thermosetting resin.

公开(公告)号：US11776946B2

公开(公告)日：2023-10-03

申请号：US17224520

申请日：2021-04-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junho Cho ,  Ohchul Kwon ,  Seungjin Cheon ,  Tea-Geon Kim ,  Bubryong Lee ,  Junglae Jung

IPC: H01L25/00 ,  H01L23/00 ,  H01L25/18 ,  H01L23/538 ,  H01L21/56

CPC classification number: H01L25/50 ,  H01L21/565 ,  H01L23/5385 ,  H01L24/09 ,  H01L24/17 ,  H01L24/32 ,  H01L24/46 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L24/91 ,  H01L24/92 ,  H01L25/18 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L2224/13101 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/92225 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/15311 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/15311 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/13101 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: A method of manufacturing a package-on-package device includes a bonding step carried out by a bonding apparatus including a pressing member and a light source that produces a laser beam. A bottom package including a lower substrate, lower solder balls alongside an edge of the lower substrate, and a lower chip on a center of the lower substrate is provided, the bottom package is bonded to an interposer substrate having upper solder balls aligned with the lower solder balls, and a top package having an upper substrate and an upper chip on the upper substrate is bonded to the interposer substrate. While the interposer substrate is disposed on the bottom package, the pressing member presses the interposer substrate against the bottom package, and the laser beam adheres the lower solder balls to the upper solder balls.

公开(公告)号：US10748855B2

公开(公告)日：2020-08-18

申请号：US15900284

申请日：2018-02-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tea-Geon Kim ,  Jung Lae Jung

IPC: H01L23/00 ,  B32B37/22 ,  H01L21/67 ,  H01L21/48 ,  B32B37/10 ,  H01L21/66 ,  H01L23/498

Abstract: A method of fabricating a semiconductor package using a laminating device is provided. The method includes placing a substrate on a substrate stand; providing a pressurizing unit which is expandable and includes a convex surface facing an upper surface of the substrate stand, on the substrate stand; injecting air into the pressurizing unit using a plate which is connected to the pressurizing unit; and supplying a film by a film supply unit which supplies the film between the substrate stand and the pressurizing unit, wherein the pressurizing unit attaches the film onto the substrate, while expanding.

公开(公告)号：US10665477B2

公开(公告)日：2020-05-26

申请号：US15392008

申请日：2016-12-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tea-Geon Kim

IPC: H01L21/67 ,  B08B1/02 ,  B08B3/14 ,  B08B3/12 ,  B08B3/04 ,  B08B1/00 ,  B08B1/04 ,  B08B3/10 ,  B08B3/00

Abstract: A substrate cleaning apparatus includes a porous suction part having a polygonal pillar shape with a plurality of cleaning surfaces, a transfer unit to transfer a substrate with a plurality of semiconductor devices toward the porous suction part, and to contact the semiconductor devices with one of the plurality of cleaning surfaces, and a rotation driving part to rotate the porous suction part.

公开(公告)号：US10373330B2

公开(公告)日：2019-08-06

申请号：US15405905

申请日：2017-01-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tea-Geon Kim

IPC: G06K9/46 ,  G06T7/00 ,  G06T7/70 ,  G06K9/32 ,  G06T7/73

Abstract: A method for predicting the location of mark is performed for a substrate which includes a plurality of electronic device regions each electronic region includes a mark and a reference indication on a first surface and a sawing indication on a second surface opposite to the first surface. The method includes obtaining first and second image information for the first and second surfaces, extracting a sawing line based on the sawing indication in the second image information, calculating a first spaced distance between the sawing line and the reference indication in the first information, calculating a second spaced distance between the sawing line and the reference indication, and predicting the location of the mark based on whether the first and second spaced distances correspond to a predetermined reference distance. The mark is on each of the electronic device regions separated from each other along the sawing line.