Invention Grant
- Patent Title: Power amplifier module
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Application No.: US16154861Application Date: 2018-10-09
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Publication No.: US10666201B2Publication Date: 2020-05-26
- Inventor: Hisanori Namie , Satoshi Goto , Satoshi Tanaka
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4d2a7aa3
- Main IPC: H03F3/191
- IPC: H03F3/191 ; H03F1/02 ; H03F3/21 ; H03F1/56 ; H03F1/52 ; H03F3/24

Abstract:
A power amplifier module includes a first power amplifier circuit configured to output a first amplified signal obtained by amplifying an input signal; a second power amplifier circuit configured to output a second amplified signal obtained by amplifying the first amplified signal; and a matching network connected between the first power amplifier circuit and the second power amplifier circuit. The matching network includes a first capacitor connected in series between the first power amplifier circuit and the second power amplifier circuit, a second capacitor connected in series between the first capacitor and the second power amplifier circuit, a first inductor connected between a point between the first capacitor and the second capacitor and a ground, and a second inductor connected in series between the first power amplifier circuit and the first capacitor.
Public/Granted literature
- US20190109565A1 POWER AMPLIFIER MODULE Public/Granted day:2019-04-11
Information query
IPC分类: