- 专利标题： High temperature devices and applications employing pure aluminum braze for joining components of said devices
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申请号： US15885870申请日： 2018-02-01
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公开(公告)号： US10668574B2公开(公告)日： 2020-06-02
- 发明人: Jainagesh Sekhar
- 申请人： Jainagesh Sekhar
- 申请人地址： US OH Cincinnati
- 专利权人： MHI Health Devices, LLC
- 当前专利权人： MHI Health Devices, LLC
- 当前专利权人地址： US OH Cincinnati
- 代理商 Michael C. Connelly
- 主分类号： B23K1/00
- IPC分类号： B23K1/00 ; B23K35/28 ; B23K1/20 ; B23K35/02 ; B23K1/005 ; B23K35/00 ; B23K1/19 ; B23K1/012 ; B23K101/20 ; B23K103/02 ; B23K103/00 ; B23K101/36 ; B23K103/18
摘要：
The present applicant presents a structure intended for high temperature use above 30° C. comprising multiple components having metal-to-metal or metal-to-ceramic contacting surfaces wherein the surfaces are joined by a braze composed of pure aluminum. Anticipated devices include but are not limited to igniters as well as electronic applications in the automotive and aerospace industries.
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