Invention Grant
- Patent Title: Polyimide solution, heat-resistant non-woven fabric, and method for manufacturing same
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Application No.: US15517783Application Date: 2015-10-02
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Publication No.: US10669377B2Publication Date: 2020-06-02
- Inventor: Natsuko Chayama , Masao Tomikawa , Tomoyuki Yuba
- Applicant: TORAY INDUSTRIES, INC.
- Applicant Address: JP Tokyo
- Assignee: TORAY INDUSTRIES, INC.
- Current Assignee: TORAY INDUSTRIES, INC.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@538bc824
- International Application: PCT/JP2015/078028 WO 20151002
- International Announcement: WO2016/056480 WO 20160414
- Main IPC: C08G73/10
- IPC: C08G73/10 ; D04H1/4326 ; D04H1/728 ; D01F6/74 ; D01D5/00 ; D01D1/02 ; H01M2/14 ; H01M2/16 ; C08L79/08

Abstract:
The present invention provides a polyimide solution which does not require a ring-closing process at a high temperature for obtaining a heat-resistant polyimide non-woven fabric and which is hardly affected by atmosphere humidity in fiber production by electrospinning, so that a fiber with a stable diameter can be obtained in any circumstance.A polyimide solution including: (a) a resin containing 50 mol % or more, based on the total amount of the resin, of a structural unit represented by the general formula (1); and (b) a solvent.
Public/Granted literature
- US20170342214A1 POLYIMIDE SOLUTION, HEAT-RESISTANT NON-WOVEN FABRIC, AND METHOD FOR MANUFACTURING SAME Public/Granted day:2017-11-30
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