公开(公告)号：US11279802B2

公开(公告)日：2022-03-22

申请号：US16969315

申请日：2019-03-15

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yutaro Koyama ,  Yuki Masuda ,  Masao Tomikawa

IPC: C08G73/10 ,  G03F7/038 ,  H01L23/31 ,  H01L23/498 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40

Abstract: The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein X1 represents a divalent organic group having 2 to 100 carbon atoms, Y1 and Y2 each represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, X2 represents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and n1 and n2 each represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as X1 of the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of X1 and X2, and (II) an organic group having a diphenyl ether structure is contained as Y1 of the general formula (1) at a content of 1 to 30 mol % based on 100 mol % of a total of Y1 and Y2.

公开(公告)号：US10669377B2

公开(公告)日：2020-06-02

申请号：US15517783

申请日：2015-10-02

Applicant: TORAY INDUSTRIES, INC.

Inventor： Natsuko Chayama ,  Masao Tomikawa ,  Tomoyuki Yuba

IPC: C08G73/10 ,  D04H1/4326 ,  D04H1/728 ,  D01F6/74 ,  D01D5/00 ,  D01D1/02 ,  H01M2/14 ,  H01M2/16 ,  C08L79/08

Abstract: The present invention provides a polyimide solution which does not require a ring-closing process at a high temperature for obtaining a heat-resistant polyimide non-woven fabric and which is hardly affected by atmosphere humidity in fiber production by electrospinning, so that a fiber with a stable diameter can be obtained in any circumstance.A polyimide solution including: (a) a resin containing 50 mol % or more, based on the total amount of the resin, of a structural unit represented by the general formula (1); and (b) a solvent.

公开(公告)号：US10177022B2

公开(公告)日：2019-01-08

申请号：US15502406

申请日：2015-08-05

Applicant: TORAY INDUSTRIES, INC.

Inventor： Shinji Arimoto ,  Takenori Fujiwara ,  Masao Tomikawa

IPC: C09J183/14 ,  H01L21/683 ,  C08G73/10 ,  C09J7/00 ,  C09J11/06 ,  C08K5/544 ,  C09J179/08 ,  C09J183/04 ,  C11D7/50 ,  C08L79/08 ,  C08L83/04 ,  H01L21/304 ,  H01L21/02 ,  B32B7/12 ,  B32B43/00 ,  C09J5/00 ,  H01L21/768

Abstract: The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.

公开(公告)号：US20160222165A1

公开(公告)日：2016-08-04

申请号：US15021144

申请日：2014-09-18

Applicant: TORAY INDUSTRIES, INC.

Inventor： Junji Wakita ,  Yukari Arimoto ,  Masao Tomikawa

IPC: C08G73/10 ,  H01L51/52 ,  H01L51/00 ,  H01L51/56 ,  G02B5/22 ,  G03F7/00 ,  H01L27/32

CPC classification number: C08G73/1082 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/1075 ,  C08G73/16 ,  C09D179/08 ,  G02B5/20 ,  G02B5/201 ,  G02B5/223 ,  G03F7/0007 ,  H01L27/322 ,  H01L51/0035 ,  H01L51/0097 ,  H01L51/5253 ,  H01L51/56

Abstract: The present invention provides a polyimide precursor that serves to produce a cured film that has high light permeability in combination with low birefringence and low linear thermal expansion. The polyimide precursor includes at least an acid dianhydride residue as represented by Formula (1), a diamine residue as represented by Formula (2), and one or more diamine residues as represented by Formula (3), the acid dianhydride residue as represented by Formula (1) accounting for 50 mol % or more of the total quantity of acid dianhydride residues in the polyimide precursor, the diamine residue as represented by Formula (2) accounting for 50 mol % or more of the total quantity of diamine residues in the polyimide precursor, and the diamine residue as represented by Formula (3) accounting for 15 mol % or less of the total quantity of diamine residues in the polyimide precursor.

Abstract translation: 本发明提供一种聚酰亚胺前体，其用于制造具有高透光性和低双折射率和低线性热膨胀的固化膜。 聚酰亚胺前体至少包括由式（1）表示的酸二酐残基，由式（2）表示的二胺残基和由式（3）表示的一个或多个二胺残基，所述酸二酐残基如 式（1）占聚酰亚胺前体中酸二酐残基总量的50mol％以上，式（2）表示的二胺残基占二胺残基总量的50mol％以上 聚酰亚胺前体和由式（3）表示的二胺残基占聚酰亚胺前体中二胺残基总量的15摩尔％以下。

公开(公告)号：US20150045502A1

公开(公告)日：2015-02-12

申请号：US14387609

申请日：2013-03-28

Applicant: TORAY Industries, Inc.

Inventor： Daichi Miyazaki ,  Masao Tomikawa

IPC: C08G69/44 ,  C08G73/10 ,  C09D179/08

CPC classification number: C09D179/08 ,  C08G69/44 ,  C08G73/1007 ,  C08G73/101 ,  C08G73/1067 ,  C08G73/1071 ,  C08G73/1075 ,  C08G73/1082 ,  C08G2150/00

Abstract: The invention aims to provide polyamic acid that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics and further aims to produce cured coat film with good mechanical characteristics regardless of whether the molar concentration of the acid anhydride group in the acid dianhydride monomer and that of the amino group in the multivalent amine compound or diamine compound are identical to or different from each other. This objective is met by polyamic acid including a structure as represented by chemical formula (1) given below: (In chemical formula (1), δ represents an oxygen or sulfur atom and W represents an electron-withdrawing group, and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.

Abstract translation: 本发明的目的在于提供可形成低粘度的清漆的聚酰胺酸，并且用于通过固化具有良好的机械特性的涂膜来制备具有良好机械特性的固化涂膜，而不管是否将 酸二酐单体中的酸酐基和多价胺化合物或二胺化合物中的氨基的酸酐基彼此相同或不同。 该聚酰胺酸包括下述化学式（1）表示的结构：（化学式（1）中，δ表示氧原子或硫原子，W表示吸电子基团，R 11和R 12表示 独立地为氢原子或碳原子数为1〜10的烃基。

公开(公告)号：US09822281B2

公开(公告)日：2017-11-21

申请号：US15225569

申请日：2016-08-01

Applicant: TORAY INDUSTRIES, INC.

Inventor： Daichi Miyazaki ,  Masao Tomikawa

IPC: C08L77/00 ,  D21H17/55 ,  C08F8/00 ,  C08L83/00 ,  C08G69/26 ,  C09D179/08 ,  C08G73/10 ,  C08G69/44

CPC classification number: C09D179/08 ,  C08G69/44 ,  C08G73/1007 ,  C08G73/101 ,  C08G73/1067 ,  C08G73/1071 ,  C08G73/1075 ,  C08G73/1082 ,  C08G2150/00

Abstract: A polyamic acid useful for forming a protective or insulative layer for semiconductor elements has a structure represented by chemical formula (1): wherein δ represents an oxygen or sulfur atom; W represents an electron-withdrawing group; and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.

公开(公告)号：US20160372357A1

公开(公告)日：2016-12-22

申请号：US15121446

申请日：2015-02-24

Applicant: TORAY INDUSTRIES, INC.

Inventor： Masao Tomikawa ,  Takuo Watanabe ,  Chungseo Lee

IPC: H01L21/683 ,  C08G77/455 ,  B32B27/28 ,  C09J7/02 ,  B32B7/12 ,  H01L21/304 ,  C09J179/08

CPC classification number: H01L21/6836 ,  B32B7/12 ,  B32B27/281 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2457/00 ,  B32B2457/14 ,  C08G73/1039 ,  C08G73/1046 ,  C08G73/106 ,  C08G73/1082 ,  C08G77/455 ,  C08G2170/00 ,  C08L61/28 ,  C09J7/28 ,  C09J7/29 ,  C09J179/08 ,  C09J2203/326 ,  H01L21/304 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A polyimide resin includes an acid anhydride residue; and a diamine residue, the polyimide resin including a residue of a polysiloxane diamine represented by Formula (1) in an amount of not less than 60% by mole in the total amount of the diamine residue: wherein, n is a natural number and an average value thereof calculated from the average molecular weight of the polysiloxane diamine is 45 to 200; R1 and R2, the same or different, each represent an alkylene group having 1 to 30 carbon atoms or a phenylene group; and R3 to R6, the same of different, each represent an alkyl group having 1 to 30 carbon atoms, a phenyl group or a phenoxy group.

Abstract translation: 其中n为自然数，其平均值由聚硅氧烷二胺的平均分子量计算为45〜200; R 1和R 2相同或不同，分别表示碳原子数1〜30的亚烷基或亚苯基。 R 3〜R 6相同，各自表示碳原子数1〜30的烷基，苯基或苯氧基。

公开(公告)号：US20150203631A1

公开(公告)日：2015-07-23

申请号：US14417083

申请日：2013-07-30

Applicant: TORAY INDUSTRIES, INC.

Inventor： Daichi Miyazaki ,  Masao Tomikawa

IPC: C08G69/32 ,  C03C17/32 ,  C09D179/08 ,  C08G73/10 ,  C08J5/18

CPC classification number: C08G69/32 ,  C03C17/32 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/1067 ,  C08G73/1071 ,  C08J5/18 ,  C09D179/08 ,  Y10T428/31623

Abstract: An object is to provide a polyamic acid resin composition that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics. Another object is to provide a polyamic acid resin composition in which the acid anhydride terminal group is low in reactivity with diamine and which can give a varnish that does not suffer significant precipitation of diamine. These objects can be met by a polyamic acid resin composition that contains: (a) polyamic acid and (b) a compound as represented by chemical formula (1). (In Chemical formula (1), Z is a di- or higher-valent organic group containing 2 or more carbon atoms, V is a structure as represented by chemical formula (2), and k is an integer of 2 or more.) (In In Chemical formula (2), δ represents oxygen or sulfur atom and W represents an electron-withdrawing group, and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group containing 1 to 10 carbon atoms.

Abstract translation: 本发明的目的是提供一种聚酰胺酸树脂组合物，其可以形成具有低粘度的清漆，并用于通过固化生产具有良好机械特性的涂膜。 另一个目的是提供一种聚酰胺酸树脂组合物，其中酸酐端基与二胺的反应性低，可以得到不会发生二胺显着沉淀的清漆。 这些目的可以通过聚酰胺酸树脂组合物来满足，该组合物包含：（a）聚酰胺酸和（b）由化学式（1）表示的化合物。 （化学式（1）中，Z为含有2个以上碳原子的二价以上的有机基团，V为化学式（2）所示的结构，k为2以上的整数。 （In化学式（2）中，δ表示氧或硫原子，W表示吸电子基团，R 11和R 12分别独立地表示氢原子或含有1〜10个碳原子的烃基。

公开(公告)号：US10941320B2

公开(公告)日：2021-03-09

申请号：US16186676

申请日：2018-11-12

Applicant: Toray Industries, Inc.

Inventor： Shinji Arimoto ,  Takenori Fujiwara ,  Masao Tomikawa

IPC: H01L21/683 ,  C09J7/10 ,  C08G73/10 ,  C09J11/06 ,  C08K5/544 ,  C09J179/08 ,  C09J183/04 ,  C11D7/50 ,  C08L79/08 ,  C08L83/04 ,  H01L21/304 ,  H01L21/02 ,  B32B7/12 ,  B32B43/00 ,  C09J5/00 ,  C09J183/14 ,  H01L21/768

Abstract: The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.

公开(公告)号：US20190080952A1

公开(公告)日：2019-03-14

申请号：US16186676

申请日：2018-11-12

Applicant: Toray Industries, Inc.

Inventor： Shinji Arimoto ,  Takenori Fujiwara ,  Masao Tomikawa

IPC: H01L21/683 ,  C08G73/10 ,  B32B43/00 ,  C09J5/00 ,  C09J183/14 ,  C11D7/50 ,  H01L21/02 ,  B32B7/12 ,  C09J7/00 ,  C09J11/06 ,  C08K5/544 ,  C09J179/08 ,  C09J183/04 ,  C08L79/08 ,  C08L83/04 ,  H01L21/304 ,  H01L21/768

Abstract: The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.