A polyamide composition with improved melt flow containing (A) 20 to 99.9 wt % of one or more polyamides independently selected from the group consisting of aliphatic polyamide, semi-aromatic polyamide, aromatic polyamide and their blends, (B) 0.1 to 10 wt % of one or more polyether polyols having a melting temperature below room temperature, (C) 0 to 70 wt % of one or more reinforcing agents, and (D) 0 to 50 wt % of one or more other additives, each based on the whole composition. A molding article produced from the polyamide composition also is disclosed.