Invention Grant
- Patent Title: Stretchable interconnects for flexible electronic surfaces
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Application No.: US15326224Application Date: 2015-07-14
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Publication No.: US10672531B2Publication Date: 2020-06-02
- Inventor: Narahari Pujari , Bawa Singh , Ravi Bhatkal , Siuli Sarkar , Anubhav Rustogi
- Applicant: Alpha Assembly Solutions Inc.
- Applicant Address: US NJ Somerset
- Assignee: Alpha Assembly Solutions Inc.
- Current Assignee: Alpha Assembly Solutions Inc.
- Current Assignee Address: US NJ Somerset
- Agency: Carmody Torrance Sandak & Hennessey LLP
- International Application: PCT/GB2015/052024 WO 20150714
- International Announcement: WO2016/012753 WO 20160128
- Main IPC: H01B1/22
- IPC: H01B1/22 ; H05K1/09 ; B22F1/00 ; B22F1/02 ; B23K35/02 ; B23K35/30 ; B23K35/36 ; B23K35/362 ; H05K3/12 ; H05K1/18
Abstract:
A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
Public/Granted literature
- US20170200527A1 Stretchable Interconnects for Flexible Electronic Surfaces Public/Granted day:2017-07-13
Information query
