公开(公告)号：US12113039B2

公开(公告)日：2024-10-08

申请号：US17245397

申请日：2021-04-30

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik Ghoshal ,  Nirmalya Kumar Chaki ,  Poulami Sengupta Roy ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01L23/00 ,  B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F7/04 ,  B23K1/00 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/365 ,  B23K101/40 ,  B23K103/00 ,  H01B1/22 ,  H01L25/00 ,  H05K3/32 ,  H10K50/842

CPC classification number: H01L24/29 ,  B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F7/04 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3601 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/365 ,  H01B1/22 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  B22F2007/047 ,  B22F2301/255 ,  B22F2302/45 ,  B23K2101/40 ,  B23K2103/56 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13439 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27332 ,  H01L2224/27436 ,  H01L2224/27505 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32146 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81075 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8184 ,  H01L2224/81948 ,  H01L2224/83075 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/83439 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83948 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/206 ,  H01L2924/2064 ,  H05K3/321 ,  H10K50/8426 ,  H01L2224/83203 ,  H01L2924/00012 ,  H01L2224/94 ,  H01L2224/83 ,  H01L2224/29339 ,  H01L2924/0105 ,  H01L2224/29339 ,  H01L2924/01046 ,  H01L2224/29339 ,  H01L2924/01047 ,  H01L2224/29339 ,  H01L2924/01029 ,  H01L2224/29339 ,  H01L2924/01028 ,  H01L2224/29439 ,  H01L2924/00014 ,  H01L2224/29355 ,  H01L2924/00014 ,  H01L2224/29347 ,  H01L2924/01028 ,  H01L2224/29347 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2224/29387 ,  H01L2924/0493 ,  H01L2924/01004 ,  H01L2224/2949 ,  H01L2924/00012 ,  H01L2224/2939 ,  H01L2924/0665 ,  H01L2224/271 ,  H01L2924/00014 ,  H01L2224/27436 ,  H01L2924/00014 ,  H01L2224/94 ,  H01L2224/27 ,  H01L2224/05155 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/83439 ,  H01L2924/00014 ,  H01L2224/83447 ,  H01L2924/01074 ,  H01L2224/8321 ,  H01L2924/00014 ,  H01L2224/81203 ,  H01L2924/00012 ,  H01L2224/94 ,  H01L2224/81 ,  H01L2224/13339 ,  H01L2924/0105 ,  H01L2224/13339 ,  H01L2924/01046 ,  H01L2224/13339 ,  H01L2924/01047 ,  H01L2224/13339 ,  H01L2924/01029 ,  H01L2224/13339 ,  H01L2924/01028 ,  H01L2224/13439 ,  H01L2924/00014 ,  H01L2224/13355 ,  H01L2924/00014 ,  H01L2224/13347 ,  H01L2924/01028 ,  H01L2224/13347 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2224/13387 ,  H01L2924/0493 ,  H01L2924/01004 ,  H01L2224/1349 ,  H01L2924/00012 ,  H01L2224/1339 ,  H01L2924/0665 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2224/11436 ,  H01L2924/00014 ,  H01L2224/94 ,  H01L2224/11 ,  H01L2224/8121 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/1132 ,  H01L2924/00014 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00

Abstract: A sintering powder comprising:



a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.

公开(公告)号：US12278022B2

公开(公告)日：2025-04-15

申请号：US18376896

申请日：2023-10-05

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Bawa Singh ,  Ravi Bhatkal ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01B1/22 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B22F1/17 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K1/09 ,  H05K1/18 ,  H05K3/12

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US20240413117A1

公开(公告)日：2024-12-12

申请号：US18806922

申请日：2024-08-16

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik Ghoshal ,  Nirmalya Kumar Chaki ,  Poulami Sengupta Roy ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01L23/00 ,  B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F7/04 ,  B23K1/00 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/365 ,  B23K101/40 ,  B23K103/00 ,  H01B1/22 ,  H01L25/00 ,  H05K3/32 ,  H10K50/842

Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.

公开(公告)号：US11139089B2

公开(公告)日：2021-10-05

申请号：US16887455

申请日：2020-05-29

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Bawa Singh ,  Ravi Bhatkal ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/00 ,  B22F1/02 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12 ,  H05K1/18

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US20210249376A1

公开(公告)日：2021-08-12

申请号：US17245397

申请日：2021-04-30

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik Ghoshal ,  Nirmalya Kumar Chaki ,  Poulami Sengupta Roy ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01L23/00 ,  B22F1/00 ,  B23K35/02 ,  B22F7/04 ,  H01B1/22 ,  B22F1/02 ,  B23K1/00 ,  B23K35/30 ,  B23K35/36 ,  B23K35/365

Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.

公开(公告)号：US10998284B2

公开(公告)日：2021-05-04

申请号：US15302827

申请日：2015-04-10

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik Ghoshal ,  Nirmalya Kumar Chaki ,  Poulami Sengupta Roy ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01L23/00 ,  B22F1/00 ,  B23K35/02 ,  B22F7/04 ,  H01B1/22 ,  B22F1/02 ,  B23K1/00 ,  B23K35/30 ,  B23K35/36 ,  B23K35/365 ,  B23K101/40 ,  B23K103/00 ,  H05K3/32 ,  H01L25/00 ,  H01L51/52

Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.

公开(公告)号：US11830640B2

公开(公告)日：2023-11-28

申请号：US17382980

申请日：2021-07-22

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Bawa Singh ,  Ravi Bhatkal ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/17 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12 ,  H05K1/18

CPC classification number: H01B1/22 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B22F1/17 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/362 ,  B23K35/3613 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/1241 ,  B22F2301/255 ,  B22F2302/45 ,  B22F2304/10 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/0203 ,  H05K2201/0245 ,  H05K2201/10106

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US11624000B2

公开(公告)日：2023-04-11

申请号：US16616701

申请日：2018-05-22

Applicant: Alpha Assembly Solutions Inc. ,  MacDermid Autotype Limited

Inventor： Nirmalya Kumar Chaki ,  Chetan Pravinchandra Shah ,  Barun Das ,  Supriya Devarajan ,  Siuli Sarkar ,  Rahul Raut ,  Bawa Singh ,  Anubhav Rustogi ,  Anna Jane Harris ,  Keith Paul Parsons ,  Jeffrey William Braham

IPC: C09D11/52 ,  C09D11/033 ,  C09D11/037 ,  C09D11/104 ,  H01H13/704

Abstract: This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.

公开(公告)号：US10672531B2

公开(公告)日：2020-06-02

申请号：US15326224

申请日：2015-07-14

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Bawa Singh ,  Ravi Bhatkal ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/00 ,  B22F1/02 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12 ,  H05K1/18

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.