Invention Grant
- Patent Title: Ring assembly and chuck assembly having the same
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Application No.: US15470044Application Date: 2017-03-27
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Publication No.: US10672629B2Publication Date: 2020-06-02
- Inventor: SungHyup Kim , Dong-Wook Kim , Sungmoon Park , JungHwan Um , Taeseok Oh
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@53563364
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; H01J37/32 ; H01L21/3065 ; H01L21/673 ; H01L21/68

Abstract:
A ring assembly and a chuck assembly therewith are provided. The ring assembly may include an edge ring that is provided to enclose a chuck body supporting a substrate. The edge ring may include a first top surface, a second top surface positioned outside the first top surface and above the first top surface, a first inner side surface connecting the first top surface to the second top surface, and at least one first flow hole extending outward from one of the first top surface and the first inner side surface, thereby penetrating the edge ring.
Public/Granted literature
- US20180090344A1 RING ASSEMBLY AND CHUCK ASSEMBLY HAVING THE SAME Public/Granted day:2018-03-29
Information query
IPC分类: