公开(公告)号：US20180090344A1

公开(公告)日：2018-03-29

申请号：US15470044

申请日：2017-03-27

申请人： Samsung Electronics Co., Ltd.

发明人： SungHyup KIM ,  Dong-Wook Kim ,  Sungmoon Park ,  JungHwan Um ,  Taeseok Oh

IPC分类号： H01L21/67 ,  H01L21/673 ,  H01J37/32 ,  H01L21/68 ,  H01L21/3065

摘要： A ring assembly and a chuck assembly therewith are provided. The ring assembly may include an edge ring that is provided to enclose a chuck body supporting a substrate. The edge ring may include a first top surface, a second top surface positioned outside the first top surface and above the first top surface, a first inner side surface connecting the first top surface to the second top surface, and at least one first flow hole extending outward from one of the first top surface and the first inner side surface, thereby penetrating the edge ring.

公开(公告)号：US10672629B2

公开(公告)日：2020-06-02

申请号：US15470044

申请日：2017-03-27

申请人： Samsung Electronics Co., Ltd.

发明人： SungHyup Kim ,  Dong-Wook Kim ,  Sungmoon Park ,  JungHwan Um ,  Taeseok Oh

IPC分类号： H01L21/67 ,  H01L21/687 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/673 ,  H01L21/68

摘要： A ring assembly and a chuck assembly therewith are provided. The ring assembly may include an edge ring that is provided to enclose a chuck body supporting a substrate. The edge ring may include a first top surface, a second top surface positioned outside the first top surface and above the first top surface, a first inner side surface connecting the first top surface to the second top surface, and at least one first flow hole extending outward from one of the first top surface and the first inner side surface, thereby penetrating the edge ring.