Invention Grant
- Patent Title: Transistor with shield structure, packaged device, and method of fabrication
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Application No.: US16142713Application Date: 2018-09-26
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Publication No.: US10672703B2Publication Date: 2020-06-02
- Inventor: Vikas Shilimkar , Kevin Kim , Hernan Rueda , Humayun Kabir
- Applicant: NXP USA, Inc.
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Agent Charlene R. Jacobsen
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/528 ; H01L23/31 ; H01L21/56 ; H01L27/088 ; H01L21/8234

Abstract:
A transistor includes a semiconductor substrate having an active device region formed therein and an interconnect structure on a first surface of the semiconductor substrate. The interconnect structure is formed of multiple layers of dielectric material and electrically conductive material. Drain and gate runners are formed in the interconnect structure. A shield structure extends above a second surface of the interconnect structure, the shield structure being positioned between the drain and gate runners.
Public/Granted literature
- US20200098683A1 TRANSISTOR WITH SHIELD STRUCTURE, PACKAGED DEVICE, AND METHOD OF FABRICATION Public/Granted day:2020-03-26
Information query
IPC分类: