- 专利标题： Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
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申请号： US15737504申请日： 2016-07-04
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公开(公告)号： US10676579B2公开(公告)日： 2020-06-09
- 发明人: Katsuya Tomizawa , Yoichi Takano , Meguru Ito , Eisuke Shiga
- 申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 申请人地址： JP Tokyo
- 专利权人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 当前专利权人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 当前专利权人地址： JP Tokyo
- 代理机构： Greenblum & Bernstein, P.L.C.
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2d82e3bd
- 国际申请： PCT/JP2016/069754 WO 20160704
- 国际公布： WO2017/006897 WO 20170112
- 主分类号： C08J5/24
- IPC分类号： C08J5/24 ; B32B27/30 ; H05K1/03 ; C08L35/00 ; B32B5/00 ; C08F2/44 ; B32B15/082 ; C09D4/00 ; B32B27/00 ; B32B15/08 ; C08G61/10 ; H05K1/09
摘要：
It is intended to provide a resin composition that serves as a raw material for a printed circuit board excellent in heat resistance after moisture absorption and is excellent in moldability. The resin composition of the present invention contains a maleimide compound, a silane compound having a carbon-carbon unsaturated bond and a hydrolyzable group or a hydroxy group, a silane compound having an epoxy skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.
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