Invention Grant
- Patent Title: Optical fiber interface for optical device package
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Application No.: US15520829Application Date: 2014-10-23
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Publication No.: US10677995B2Publication Date: 2020-06-09
- Inventor: Terrel L Morris , Raymond G Beausoleil , Jason Pelc , Marco Fiorentino , Charles M Santori , Michael W Cumbie
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Nolte Intellectual Property Law Group
- International Application: PCT/US2014/061960 WO 20141023
- International Announcement: WO2016/064402 WO 20160428
- Main IPC: G02B6/36
- IPC: G02B6/36 ; G02B6/42

Abstract:
One example includes an optical fiber interface. The interface includes a first substrate comprising a pair of opposing surfaces. The substrate includes an opening extending therethrough that defines an inner periphery. One surface of the opposing surfaces of the first substrate can be configured to be bonded to a given surface of a second substrate. The interface also includes a plurality of optical fibers secured to the other opposing surface of the first substrate and extending inwardly from a plurality of surfaces of the inner periphery at fixed locations to align the set of optical fibers to optical inputs/outputs (I/O) of an optical system chip that is coupled to the given surface of the second substrate and received through the opening.
Public/Granted literature
- US20170315298A1 OPTICAL FIBER INTERFACE FOR OPTICAL DEVICE PACKAGE Public/Granted day:2017-11-02
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