公开(公告)号：US10261256B2

公开(公告)日：2019-04-16

申请号：US15546283

申请日：2015-01-28

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Raymond G Beausoleil ,  Marco Fiorentino ,  Jason Pelc ,  Charles M Santori ,  Terrel L Morris

IPC: G02B6/12 ,  G02B6/13 ,  G02B6/26 ,  H04B10/80 ,  G02B6/122 ,  G02B6/14 ,  G02B6/28 ,  G02B6/00

Abstract: One example includes an apparatus that includes a plurality of input/output (I/O) ports and a body portion. The plurality of I/O ports can be arranged at a plurality of peripheral surfaces of the body portion. The body portion includes a solid dielectric material having a substantially constant index of refraction. The body portion also includes parallel planar surfaces spaced apart by and bounded by the plurality of peripheral surfaces. The solid dielectric material in the body portion can be writable via a laser-writing process to form an optical waveguide extending between a set of the plurality of I/O ports.

公开(公告)号：US10677995B2

公开(公告)日：2020-06-09

申请号：US15520829

申请日：2014-10-23

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Terrel L Morris ,  Raymond G Beausoleil ,  Jason Pelc ,  Marco Fiorentino ,  Charles M Santori ,  Michael W Cumbie

IPC: G02B6/36 ,  G02B6/42

Abstract: One example includes an optical fiber interface. The interface includes a first substrate comprising a pair of opposing surfaces. The substrate includes an opening extending therethrough that defines an inner periphery. One surface of the opposing surfaces of the first substrate can be configured to be bonded to a given surface of a second substrate. The interface also includes a plurality of optical fibers secured to the other opposing surface of the first substrate and extending inwardly from a plurality of surfaces of the inner periphery at fixed locations to align the set of optical fibers to optical inputs/outputs (I/O) of an optical system chip that is coupled to the given surface of the second substrate and received through the opening.

公开(公告)号：US10888011B2

公开(公告)日：2021-01-05

申请号：US15521616

申请日：2014-10-27

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Terrel L Morris

IPC: H05K5/00 ,  H05K1/18 ,  H05K7/14 ,  H05K1/11 ,  H05K7/02 ,  H05K7/00

Abstract: A network packaging system can include a circuit board that includes a chip located substantially in a center of the board. A backplane is in communication with the chip and located along on a first edge of the circuit board. A plurality of connector ports are arranged along the perimeter of at least two other edges of the circuit board. A plurality of traces connects the plurality of connector ports to the chip. A support structure houses one or more circuit boards, with at least two sidewall surfaces of the support structure extending substantially orthogonal to and coextensive with each of the at least two edges of the circuit board. The support structure includes a plurality of apertures extending through the one or more surfaces spatially aligned with each of the plurality of connector ports.

公开(公告)号：US10534148B2

公开(公告)日：2020-01-14

申请号：US15521371

申请日：2014-10-24

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Terrel L Morris ,  Raymond G Beausoleil

IPC: G02B6/12 ,  G02B6/43 ,  G02B6/28 ,  G02B6/36 ,  G02B6/44

Abstract: One example includes an optical interconnect device. The optical interconnect device includes a plurality of optical fiber ports coupled to a body portion. The optical interconnect device also includes a plurality of optical fibers that are secured within the body portion. A first portion of the plurality of optical fibers can extend from a first of the plurality of optical fiber ports to a second of the plurality of optical fiber ports, and a second portion of the plurality of optical fibers can extend from the first of the plurality of optical fiber ports to a third of the plurality of optical fiber ports.

公开(公告)号：US10088634B2

公开(公告)日：2018-10-02

申请号：US15520847

申请日：2014-10-23

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Jason Pelc ,  Charles M Santori ,  Marco Fiorentino, Sr. ,  Raymond G Beausoleil ,  Terrel L Morris

IPC: G02B6/00 ,  G02B6/35 ,  G02B7/00 ,  G02B6/27

Abstract: One example includes an optical port-shuffling module. The module includes a plurality of inputs to receive a respective plurality of optical signals. The module also includes a plurality of outputs to provide the respective plurality of optical signals from the optical port-shuffling module. The module further includes a plurality of total-internal-reflection (TIR) mirrors arranged in optical paths of at least a portion of the plurality of optical signals to reflect the at least a portion of the plurality of optical signals to at least a portion of the plurality of outputs to shuffle the plurality of optical signals between the plurality of inputs and the plurality of outputs.