Invention Grant
- Patent Title: Electric field assisted placement of nanomaterials through dielectric engineering
-
Application No.: US16539071Application Date: 2019-08-13
-
Publication No.: US10679849B2Publication Date: 2020-06-09
- Inventor: Michael Engel , Mathias B. Steiner , Jaione Tirapu Azpiroz
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Joseph Petrokaitis
- Main IPC: H01L51/00
- IPC: H01L51/00 ; H01L21/02 ; H01L51/10 ; B82Y40/00

Abstract:
A method of positioning nanomaterials includes patterning guiding dielectric features from a single layer of guiding dielectric material, and producing an electric field by at least one electrode disposed on a substrate that is attenuated through the guiding dielectric features to create an attractive dielectrophoretic force that guides at least one nanostructure abutting the guiding dielectric features to be positioned on a deposition surface of the substrate.
Public/Granted literature
- US20190371603A1 ELECTRIC FIELD ASSISTED PLACEMENT OF NANOMATERIALS THROUGH DIELECTRIC ENGINEERING Public/Granted day:2019-12-05
Information query
IPC分类: