A module is disclosed. In one example, the module includes a carrier, an at least partially thermally conductive and electrically insulating body mounted on only a part of a main surface of the carrier, an at least partially electrically conductive redistribution structure on the thermally conductive and electrically insulating body, an electronic chip mounted on the redistribution structure and above the thermally conductive and electrically insulating body, and an encapsulant encapsulating at least part of the carrier, at least part of the thermally conductive and electrically insulating body, at least part of the redistribution structure, and at least part of the electronic chip.