- 专利标题： Substrate processing method
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申请号： US15690569申请日： 2017-08-30
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公开(公告)号： US10685829B2公开(公告)日： 2020-06-16
- 发明人: Taiki Hinode , Sadamu Fujii , Rei Takeaki
- 申请人： SCREEN Holdings Co., Ltd.
- 申请人地址： JP
- 专利权人： SCREEN Holdings Co., Ltd.
- 当前专利权人： SCREEN Holdings Co., Ltd.
- 当前专利权人地址： JP
- 代理机构： Ostrolenk Faber LLP
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@56632482
- 主分类号： H01L21/02
- IPC分类号： H01L21/02 ; H01L21/67 ; H01L21/687 ; B08B3/08 ; B08B7/00
摘要：
A substrate processing method includes a liquid film forming step of forming a liquid film of the low surface tension liquid, an opening-forming step of forming an opening in the center region of the liquid film, a liquid film removal step of removing the liquid film from the upper surface of the substrate by widening the opening, a low surface tension liquid supply step of supplying a low surface tension liquid toward a first liquid landing point which is set on the outside of the opening, a hydrophobic agent supply step of supplying a hydrophobic agent toward a second liquid landing point which is set on the outside of the opening and further from the opening than the first liquid landing point, and a liquid landing point moving step of moving the first liquid landing point and the second liquid landing point so as to follow widening of the opening.
公开/授权文献
- US20180061631A1 SUBSTRATE PROCESSING METHOD 公开/授权日：2018-03-01
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