- Patent Title: Thermal bonding sheet and thermal bonding sheet with dicing tape
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Application No.: US15762066Application Date: 2016-09-28
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Publication No.: US10685933B2Publication Date: 2020-06-16
- Inventor: Yuki Sugo , Nao Kamakura
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Agency: Alleman Hall Creasman & Tuttle LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2a5ed2b com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5197a512
- International Application: PCT/JP2016/078568 WO 20160928
- International Announcement: WO2017/057428 WO 20170406
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/683 ; C09J7/28 ; C09J7/26 ; C09J9/02 ; C09J7/25 ; C09J7/24 ; C09J201/00 ; C09J7/10 ; C08K3/08 ; C08K3/22 ; H01L23/31
Abstract:
A thermal bonding sheet includes a layer, in which an average area of a pore portion in a cross section of the layer after being heated at a heating rate of 1.5° C./sec from 80° C. to 300° C. under pressure of 10 MPa, and then held at 300° C. for 2.5 minutes is in a range of 0.005 μm2 to 0.5 μm2.
Public/Granted literature
- US20180277507A1 Thermal Bonding Sheet and Thermal Bonding Sheet with Dicing Tape Public/Granted day:2018-09-27
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