公开(公告)号：US20190043824A1

公开(公告)日：2019-02-07

申请号：US16074839

申请日：2016-12-13

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Nao Kamakura ,  Satoshi Honda

IPC: H01L23/00 ,  H01L21/683

Abstract: A thermal bonding sheet includes a pre-sintering layer containing copper particles and polycarbonate.

公开(公告)号：US20180257142A1

公开(公告)日：2018-09-13

申请号：US15762504

申请日：2016-09-21

Applicant: NITTO DENKO CORPORATION

Inventor： Nao Kamakura ,  Yuki Sugo

IPC: B22F7/08 ,  B32B7/06 ,  B32B27/20 ,  B32B27/36 ,  B22F3/02 ,  B22F1/00

CPC classification number: B22F7/08 ,  B22F1/0059 ,  B22F3/02 ,  B22F7/064 ,  B32B7/06 ,  B32B9/00 ,  B32B27/20 ,  B32B27/36 ,  B32B27/365 ,  C08K2003/0806 ,  C08K2003/085 ,  C08K2003/2248 ,  C08K2003/2286 ,  C09J7/10 ,  C09J9/00 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2469/00 ,  H01L21/6836 ,  H01L23/3121 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A problem is to provide a sheet which is such that a sintered body produced following sintering has a small amount of remaining organic substances. Solution means relate to a sheet comprising a pre-sintering layer. The pre-sintering layer comprises polycarbonate.

公开(公告)号：US20210198526A1

公开(公告)日：2021-07-01

申请号：US16326427

申请日：2017-05-18

Applicant: NITTO DENKO CORPORATION

Inventor： Satoshi Honda ,  Yuki Sugo ,  Mayu Shimoda

IPC: C09J7/22 ,  H01L21/683 ,  B32B27/08 ,  B32B27/20 ,  B32B27/36 ,  C09J9/02 ,  C09J11/04 ,  C09J7/38

Abstract: A sheet for heat bonding, having a pre-sintering layer that becomes a sintered layer by being heated, and a component migration prevention layer.

公开(公告)号：US10748866B2

公开(公告)日：2020-08-18

申请号：US16074839

申请日：2016-12-13

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Nao Kamakura ,  Satoshi Honda

IPC: H01L21/60 ,  H01L23/00 ,  B23K20/00 ,  H01L21/52 ,  B22F7/08 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B22F1/00 ,  H01L21/683 ,  B23K101/40 ,  B23K35/38 ,  B22F7/00

Abstract: A thermal bonding sheet includes a pre-sintering layer containing copper particles and polycarbonate.

公开(公告)号：US20180315729A1

公开(公告)日：2018-11-01

申请号：US15763406

申请日：2016-09-21

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Nao Kamakura

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/78 ,  B32B7/12 ,  B32B5/16 ,  C09J7/35 ,  C09J11/04

CPC classification number: H01L24/83 ,  C09J7/20 ,  C09J11/04 ,  C09J201/00 ,  H01L21/52 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Provided is a thermal bonding sheet capable of preventing bonding irregularity by uniform thickness, and imparting the bonding reliability at high temperatures, and a thermal bonding sheet with dicing tape having the thermal bonding sheet. A thermal bonding sheet includes a precursor layer that is to become a sintered layer by heating, and the precursor layer has an average thickness of 5 μm to 200 μm, and a maximum thickness and a minimum thickness falling within a range of ±20% of the average thickness. A thermal bonding sheet includes a precursor layer that is to become a sintered layer by heating, and the precursor layer has an average thickness of 5 μm to 200 μm, and a surface roughness Sa measured in a field of view of 200 μm×200 μm by a confocal microscope of 2 μm or less.

公开(公告)号：US20180273808A1

公开(公告)日：2018-09-27

申请号：US15763408

申请日：2016-09-28

Applicant: NITTO DENKO CORPORATION

Inventor： Nao Kamakura ,  Yuki Sugo

IPC: C09J7/28 ,  C09J7/24 ,  C09J7/25 ,  C09J9/02 ,  C09J11/04 ,  H01L21/683 ,  H01L23/00

CPC classification number: C09J7/28 ,  B32B9/00 ,  C08K3/08 ,  C08K3/10 ,  C08K2003/0806 ,  C08K2003/085 ,  C08K2003/2248 ,  C08K2003/2286 ,  C08K2201/001 ,  C09J1/00 ,  C09J7/00 ,  C09J7/10 ,  C09J7/20 ,  C09J7/24 ,  C09J7/25 ,  C09J9/02 ,  C09J11/04 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2400/16 ,  C09J2433/00 ,  C09J2469/00 ,  H01L21/52 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/27 ,  H01L2224/29239 ,  H01L2224/29247 ,  H01L2224/29286 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8384 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A problem is to provide a sheet having a pre-sintering layer, the thickness of which following sintering is such as to be capable of relieving stresses. Solution means relate to a sheet comprising a pre-sintering layer. Viscosity at 90° C. of the pre-sintering layer is not less than 0.27 MPa·s. Thickness of the pre-sintering layer is 30 μm to 200 μm.

公开(公告)号：US11817415B2

公开(公告)日：2023-11-14

申请号：US16308931

申请日：2017-05-23

Applicant: NITTO DENKO CORPORATION

Inventor： Satoshi Honda ,  Yuki Sugo ,  Nao Kamakura

IPC: C09J1/00 ,  H01L23/00 ,  C09J7/10 ,  C09J7/38 ,  C09J9/02 ,  C09J11/04 ,  H01J37/28 ,  H01L21/52 ,  H01L21/683 ,  H01L21/78 ,  C08K3/08 ,  C08K3/10 ,  C09J9/00

CPC classification number: H01L24/32 ,  C09J1/00 ,  C09J7/10 ,  C09J7/385 ,  C09J9/00 ,  C09J9/02 ,  C09J11/04 ,  H01J37/28 ,  H01L21/52 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/83 ,  C08K3/08 ,  C08K3/10 ,  C09J2203/326 ,  C09J2301/408 ,  C09J2400/16 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, and the precursor layer includes sinterable metallic particles and an organic component, the precursor layer has a phase separation structure that is a sea-island structure or a co-continuous structure, and in a SEM surface observation image on at least one surface of the precursor layer, a maximum value among each diameter of the largest inscribed circle for a region occupied by each phase of the phase separation structure is 1 μm or more and 50 μm or less.

公开(公告)号：US10301509B2

公开(公告)日：2019-05-28

申请号：US15539657

申请日：2015-12-11

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Nao Kamakura ,  Tsuyoshi Ishizaka ,  Mitsuaki Fusumada

IPC: C08K3/08 ,  C08K3/22 ,  C09J5/06 ,  C09J7/10 ,  C09J7/35 ,  C09J9/02 ,  G01N1/44 ,  C09J11/04 ,  H01L21/52 ,  C09J133/00 ,  C09J133/08 ,  C09J133/26 ,  C09J169/00 ,  C09J201/08 ,  H01L21/304

Abstract: A sheet for thermal bonding which has a tensile modulus of 10 to 3,000 MPa and contains fine metal particles in an amount in the range of 60-98 wt % and which, when heated from 23° C. to 400° C. in the air at a heating rate of 10° C./min and then examined by energy dispersive X-ray spectrometry, has a carbon concentration of 15 wt % or less.

公开(公告)号：US20190047081A1

公开(公告)日：2019-02-14

申请号：US16075260

申请日：2016-12-13

Applicant: NITTO DENKO CORPORATION

Inventor： Nao Kamakura ,  Yuki Sugo ,  Satoshi Honda

IPC: B23K20/16 ,  B22F7/08

CPC classification number: B23K20/16 ,  B22F3/14 ,  B22F7/08 ,  B22F2201/01 ,  B22F2201/02 ,  B22F2201/20 ,  B22F2999/00 ,  B23K20/026 ,  B23K35/0222 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/38 ,  B23K2101/36 ,  B23K2101/40 ,  B23K2103/56 ,  B32B5/16 ,  B32B15/00 ,  B32B37/04 ,  B32B37/06 ,  B32B37/1009 ,  B32B37/24 ,  B32B2305/342 ,  B32B2305/80 ,  B32B2309/022 ,  B32B2309/125 ,  B32B2309/68 ,  B32B2311/04 ,  B32B2311/08 ,  B32B2311/12 ,  B32B2311/22 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27436 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/8309 ,  H01L2224/83191 ,  H01L2224/83204 ,  H01L2224/8384 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/27

Abstract: Provided is a joint manufacturing method including: a step A of preparing a laminate in which two objects to be joined are temporarily adhered with a heat-joining sheet including a pre-sintering layer interposed between the two objects to be joined; a step B of increasing a temperature of the laminate from a temperature equal to or lower than a first temperature defined below to a second temperature; and a step C of holding the temperature of the laminate in a predetermined range after the step B, in which the laminate is pressurized during at least a part of the step B and at least a part of the step C. The first temperature is a temperature at which an organic component contained in the pre-sintering layer is decreased by 10% by weight when the pre-sintering layer is subjected to thermogravimetric measurement.

公开(公告)号：US20170369744A1

公开(公告)日：2017-12-28

申请号：US15539657

申请日：2015-12-11

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Nao Kamakura ,  Tsuyoshi Ishizaka ,  Mitsuaki Fusumada

IPC: C09J5/06 ,  C09J11/04 ,  C09J133/26 ,  C09J9/02 ,  C09J7/02 ,  C09J169/00 ,  C09J201/08 ,  G01N1/44 ,  H01L21/304 ,  H01L21/52

CPC classification number: C09J5/06 ,  C08K2003/0806 ,  C08K2003/085 ,  C08K2003/2248 ,  C08K2003/2286 ,  C08K2201/001 ,  C08L2312/06 ,  C09J7/10 ,  C09J7/35 ,  C09J9/02 ,  C09J11/04 ,  C09J133/00 ,  C09J133/08 ,  C09J133/26 ,  C09J169/005 ,  C09J201/08 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2469/00 ,  G01N1/44 ,  H01L21/3043 ,  H01L21/52 ,  H01L21/6836 ,  H01L23/00 ,  H01L2221/68327 ,  H01L2221/68381

Abstract: A sheet for thermal bonding which has a tensile modulus of 10 to 3,000 MPa and contains fine metal particles in an amount in the range of 60-98 wt % and which, when heated from 23° C. to 400° C. in the air at a heating rate of 10° C./min and then examined by energy dispersive X-ray spectrometry, has a carbon concentration of 15 wt % or less.