发明授权
- 专利标题: Artificial synapse with hafnium oxide-based ferroelectric layer in CMOS front-end
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申请号: US16395084申请日: 2019-04-25
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公开(公告)号: US10686040B2公开(公告)日: 2020-06-16
- 发明人: Martin M. Frank , Takashi Ando , Xiao Sun , Jin Ping Han , Vijay Narayanan
- 申请人: International Business Machines Corporation
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Michael J. Chang, LLC
- 代理商 Vazken Alexanian
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L29/12 ; H01L29/06 ; H01L27/085 ; H01L23/52 ; H01L21/8234
摘要:
Artificial synaptic devices with a HfO2-based ferroelectric layer that can be implemented in the CMOS front-end are provided. In one aspect, a method of forming a FET device is provided. The method includes: forming a shallow STI region in a substrate separating a first active area of the substrate from a second active area of the substrate; forming at least one FeFET on the substrate in the first active area having a ferroelectric material including a HfO2-based material; and forming at least one logic FET alongside the at least one FeFET on the substrate in the second active area, wherein the at least one logic FET has a gate dielectric including the HfO2-based material. A FET device formed by the present techniques is also provided.
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