Invention Grant
- Patent Title: Cutting tool
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Application No.: US15576889Application Date: 2016-05-30
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Publication No.: US10688565B2Publication Date: 2020-06-23
- Inventor: Satoshi Mori , Yaocan Zhu
- Applicant: Kyocera Corporation
- Applicant Address: JP Kyoto-shi, Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto-shi, Kyoto
- Agency: Viering, Jentschura & Partner MBB
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@62f2bf51
- International Application: PCT/JP2016/065847 WO 20160530
- International Announcement: WO2016/190443 WO 20161201
- Main IPC: B23B27/14
- IPC: B23B27/14 ; C23C30/00 ; C23C14/06 ; C23C28/00 ; C23C14/32 ; C23C28/04 ; C23C16/26 ; C23C16/503
Abstract:
In an embodiment, a cutting tool is disclosed. The cutting tool includes a base member and a DLC layer. The DLS layer contains diamond-like carbon and is located on a surface of the base member. The DLC layer includes one or more first regions. Each of the one or more first regions contains argon by 0.1-1 mass %.
Public/Granted literature
- US20180147635A1 CUTTING TOOL Public/Granted day:2018-05-31
Information query
