Invention Grant
- Patent Title: Extreme ultraviolet lithography system, device, and method for printing low pattern density features
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Application No.: US16220324Application Date: 2018-12-14
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Publication No.: US10691014B2Publication Date: 2020-06-23
- Inventor: Yen-Cheng Lu , Shinn-Sheng Yu , Jeng-Horng Chen , Anthony Yen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: G03B27/32
- IPC: G03B27/32 ; G03B27/54 ; G03F1/26 ; G03F7/20

Abstract:
A lithography system includes a radiation source configured to generate an extreme ultraviolet (EUV) light. The lithography system includes a mask that defines one or more features of an integrated circuit (IC). The lithography system includes an illuminator configured to direct the EUV light onto the mask. The mask diffracts the EUV light into a 0-th order ray and a plurality of higher order rays. The lithography system includes a wafer stage configured to secure a wafer that is to be patterned according to the one or more features defined by the mask. The lithography system includes a pupil phase modulator positioned in a pupil plane that is located between the mask and the wafer stage. The pupil phase modulator is configured to change a phase of the 0-th order ray.
Public/Granted literature
- US20190121228A1 Extreme Ultraviolet Lithography System, Device, and Method for Printing Low Pattern Density Features Public/Granted day:2019-04-25
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