Invention Grant
- Patent Title: Layouts for connecting contacts with metal tabs or vias
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Application No.: US15644288Application Date: 2017-07-07
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Publication No.: US10691862B2Publication Date: 2020-06-23
- Inventor: Neha Nayyar , Daniel J. Dechene , David C. Pritchard , George J. Kluth
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Roberts Calderon Safran & Cole, P.C.
- Agent David Cain; Andrew M. Calderon
- Main IPC: G06F30/394
- IPC: G06F30/394 ; H01L23/522 ; H01L21/8234

Abstract:
The present disclosure relates to methodologies for designing semiconductor structures, and, more particularly, creating a methodology to connect contacts of semiconductor elements to a metal line using marker tabs to reserve space for future connections between the contacts and the metal line, and then reassigning the marker tabs to connections between the contacts and the metal line on different levels of a metal stack formed over the semiconductor elements.
Public/Granted literature
- US20190012422A1 DESIGN LAYOUTS FOR CONNECTING CONTACTS WITH METAL TABS OR VIAS Public/Granted day:2019-01-10
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