Invention Grant
- Patent Title: Method of interconnecting nanowires and transparent conductive electrode
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Application No.: US15547437Application Date: 2016-01-29
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Publication No.: US10692621B2Publication Date: 2020-06-23
- Inventor: Byung Hoon Lee , Chee Lip Gan , Yeng Ming Lam , Alfred A. Zinn
- Applicant: Kuprion Inc.
- Applicant Address: US CA San Jose
- Assignee: Kuprion Inc.
- Current Assignee: Kuprion Inc.
- Current Assignee Address: US CA San Jose
- Agency: Vorys, Sater, Seymour and Pease LLP
- International Application: PCT/SG2016/050043 WO 20160129
- International Announcement: WO2016/122411 WO 20160804
- Main IPC: H01B1/02
- IPC: H01B1/02 ; B82Y40/00 ; B82Y30/00 ; B82B3/00 ; H01B1/22 ; H01B13/00

Abstract:
According to embodiments of the present invention, a method of interconnecting nanowires is provided. The method includes providing a plurality of nanowires, providing a plurality of nanoparticles, and fusing the plurality of nanoparticles to the plurality of nanowires to interconnect the plurality of nanowires to each other via the plurality of nanoparticles. According to further embodiments of the present invention, a nanowire network and a transparent conductive electrode are also provided.
Public/Granted literature
- US20180033516A1 METHOD OF INTERCONNECTING NANOWIRES, NANOWIRE NETWORK AND TRANSPARENT CONDUTIVE ELECTRODE Public/Granted day:2018-02-01
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