Invention Grant
- Patent Title: Device and method for contact state inspection
-
Application No.: US16151184Application Date: 2018-10-03
-
Publication No.: US10692754B2Publication Date: 2020-06-23
- Inventor: Yung-Chang Huang , Tsun-En Kuo
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/321 ; C25D7/12 ; C25D3/38 ; H01L21/66 ; H01L21/67
Abstract:
A method includes disposing a wafer in a cup of a clamshell of an electroplating apparatus. The wafer is clamped using the cup and a cone of the clamshell. First pressure forces of contacts of the cup applied by the wafer is detected. The first pressure forces are respective compared with corresponding predetermined pressure ranges.
Public/Granted literature
- US20200020574A1 DEVICE AND METHOD FOR CONTACT STATE INSPECTION Public/Granted day:2020-01-16
Information query
IPC分类:
